XC4006E-4PQ208I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 128 8192 608 208-BFQFP |
|---|---|
| Quantity | 588 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 128 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 256 | Number of Logic Elements/Cells | 608 | ||
| Number of Gates | 6000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8192 |
Overview of XC4006E-4PQ208I – XC4000E/X Field Programmable Gate Array (FPGA) IC, 128 I/O, 608 Logic Elements, 208-BFQFP
The XC4006E-4PQ208I is an AMD XC4000E/X family Field Programmable Gate Array supplied in a 208-pin BFQFP package. It provides a mid-range resource set including 608 logic elements, approximately 8.2 kbits of on-chip RAM (8,192 bits) and 128 user I/O, targeting embedded and industrial applications that require flexible logic, on-chip memory, and a robust temperature range.
With a 4.5 V to 5.5 V supply window, surface-mount packaging and an industrial operating range of −40 °C to 100 °C, this device is suited to systems that demand reliable operation across wide environmental conditions.
Key Features
- Core Logic Approximately 608 logic elements providing programmable combinational and sequential logic capacity for glue logic, state machines and custom data paths.
- Embedded Memory Approximately 8.2 kbits (8,192 bits) of on-chip RAM for FIFOs, small buffers and local data storage.
- I/O Density 128 user I/O pins to support multiple parallel interfaces, bus connections and peripheral control lines.
- Logic Scale Around 6,000 equivalent gates for mid-range digital integration without external glue components.
- Power 5 V-class operation with a supply range of 4.5 V to 5.5 V to match legacy and industrial power domains.
- Package & Mounting 208-BFQFP (208-PQFP, 28×28) surface-mount package for compact board-level integration.
- Temperature & Grade Industrial-grade device rated for −40 °C to 100 °C operation for deployment in harsher environments.
- Compliance RoHS-compliant manufacturing.
Typical Applications
- Industrial Control & Automation Use the device’s industrial temperature rating and 128 I/O to implement control logic, sensor interfacing and actuator management in factory and process automation.
- Embedded System Glue Logic Leverage the 608 logic elements and on-chip RAM to consolidate interface timing, bus bridging and custom control functions, reducing BOM complexity.
- Prototyping and Development Mid-range logic and memory resources make this FPGA useful for proof-of-concept designs and iterative hardware development where flexibility is required.
Unique Advantages
- Balanced Logic and Memory Combines 608 logic elements with 8,192 bits of embedded RAM for efficient implementation of control functions and small data buffers on a single device.
- High I/O Count 128 user I/O pins enable direct connections to multiple peripherals and parallel buses, simplifying board design.
- Industrial Temperature Rating Rated from −40 °C to 100 °C to support deployment in temperature-challenging environments.
- 5 V-Compatible Power Domain Operates across a 4.5 V to 5.5 V supply range to integrate with legacy and industrial power systems.
- Compact Surface-Mount Package 208-BFQFP (28×28) footprint provides a space-efficient form factor for densely packed PCBs.
- RoHS Compliant Manufactured to RoHS standards for regulatory compliance in many markets.
Why Choose XC4006E-4PQ208I?
The XC4006E-4PQ208I positions itself as a practical mid-range FPGA option for engineers who need flexible programmable logic, modest embedded memory and substantial I/O in an industrial-capable package. Its combination of approximately 608 logic elements, 8,192 bits of on-chip RAM and 128 I/O pins supports a wide range of embedded control, interface and prototyping tasks while minimizing external components.
Designed for systems requiring a 5 V-class supply and reliable operation across −40 °C to 100 °C, this device delivers a compact, RoHS-compliant solution for developers focused on robustness, scalability and simplified board-level integration.
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