XC4010E-3BG225C

The XC4010E-3BG225C is a Field Programmable Gate Array (FPGA) IC from AMD’s XC4000E/X family. It provides a compact, surface-mount 225-ball BGA package and a balance of programmable logic, I/O capacity and on-chip memory suitable for commercial embedded designs.

With 950 logic elements, approximately 12,800 bits of embedded RAM and up to 160 I/O pins, this device is intended for designs that require configurable logic and memory resources within a 225-ball PBGA footprint. It operates from a 4.75 V to 5.25 V supply and is rated for commercial temperature environments (0 °C to 85 °C).

Key Features

• Logic Capacity  Offers 950 logic elements to implement custom digital logic and control functions.
• Embedded Memory  Approximately 12,800 bits of on-chip RAM for small buffers, FIFOs or state storage.
• I/O Count  Up to 160 available I/O pins to interface with external peripherals and buses.
• Gate Equivalent  Provides approximately 10,000 gates of logic density for moderate-complexity designs.
• Power  Operates from a 4.75 V to 5.25 V supply for systems using standard 5 V logic rails.
• Package  225-ball BBGA package (supplier device package: 225-PBGA, 27 × 27 mm) in a surface-mount form factor for compact board layouts.
• Commercial Temperature Grade  Specified for 0 °C to 85 °C operating range for general-purpose commercial applications.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free manufacturing.

Typical Applications

• Digital Prototyping  Implement custom logic and control functions using the device’s 950 logic elements and on-chip RAM for validation and proof-of-concept designs.
• Peripheral Interface Bridging  Use the XC4010E-3BG225C’s 160 I/O pins to bridge or glue multiple digital interfaces on a compact PCB footprint.
• Control and Sequencing  Deploy as a dedicated control engine where modest gate count and embedded RAM support finite-state machines and sequencing tasks.

Unique Advantages

• Balanced Logic and Memory: Combines 950 logic elements with approximately 12,800 bits of RAM to support integrated control and buffering without external memory for many use cases.
• Generous I/O Capacity: 160 I/O pins provide flexibility for multiple peripheral connections and bus interfaces within a single device.
• Compact BGA Package: The 225-ball PBGA (27 × 27 mm) surface-mount package enables higher I/O density and compact board integration compared with larger DIP or TQFP parts.
• Standard 5 V Operation: Operates from a 4.75 V to 5.25 V supply, simplifying integration into systems that use 5 V logic rails.
• Commercial Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance to meet common commercial product requirements.

Why Choose XC4010E-3BG225C?

The XC4010E-3BG225C delivers a practical combination of programmable logic resources, embedded RAM and I/O capacity in a surface-mount 225-ball PBGA package. Its specification set — 950 logic elements, approximately 12,800 bits of on-chip RAM, 160 I/O pins and ~10,000 gate equivalence — positions it for commercial embedded designs that need configurable logic and modest memory without large form-factor tradeoffs.

This device is well suited for engineers and procurement teams looking for a RoHS-compliant, commercially rated FPGA option that integrates into existing 5 V systems and supports compact PCB layouts. It provides a straightforward migration point for designs that require configurable logic density at this specification level.

Request a quote or submit an inquiry to receive pricing and availability for the XC4010E-3BG225C and to discuss how it fits your design requirements.