XC4010E-3BG225I

The XC4010E-3BG225I is an AMD XC4000E/X family field programmable gate array in a 225‑ball BGA package designed for surface-mount assembly. It provides a mid-range collection of programmable logic resources and on-chip memory suitable for embedded control, interface bridging, and custom logic functions in industrial environments.

With support for a 4.5 V to 5.5 V supply and an operating range from -40 °C to 100 °C, this industrial-grade FPGA delivers a combination of logic density, I/O availability, and on-chip RAM for robust, temperature-tolerant designs.

Key Features

• Logic Capacity — Approximately 950 logic elements to implement combinational and sequential logic for glue logic, state machines, and control functions.
• Configurable Logic Blocks — Device architecture provides 400 logic blocks for partitioning designs and achieving modular implementation.
• Embedded Memory — 12,800 bits of on-chip RAM for small buffering, FIFOs, and local data storage.
• I/O Resources — 160 user I/O pins to support multiple interfaces and peripheral connections directly from the FPGA.
• Package & Mounting — 225‑BBGA (225‑PBGA 27×27) surface-mount package for compact board-level integration.
• Power — Operates from a 4.5 V to 5.5 V supply, compatible with 5 V logic systems.
• Operating Temperature — Industrial temperature rating of -40 °C to 100 °C for use in temperature-challenging environments.
• RoHS Compliant — Meets RoHS requirements for lead-free assembly and regulatory alignment.

Typical Applications

• Industrial Control — Implement machine control logic and timing-critical functions using the device’s logic elements and on-chip RAM within industrial temperature ranges.
• Interface Bridging — Use the 160 I/O pins to translate or buffer between multiple peripheral interfaces and legacy buses.
• Embedded System Glue Logic — Replace discrete logic with compact FPGA-based solutions for state machines, address decoding, and custom control paths.
• Small Buffering & Data Handling — Leverage 12,800 bits of embedded RAM for local data buffering, small FIFOs, and temporary storage.

Unique Advantages

• Balanced Logic Density: Approximately 950 logic elements provide enough capacity for mid-sized designs without excessive board-level complexity.
• Generous I/O Count: 160 user I/O pins enable integration with a wide range of peripherals and system interfaces, reducing the need for external multiplexers.
• Industrial Temperature Rating: Rated from -40 °C to 100 °C to meet the demands of temperature-sensitive deployments.
• Compact BGA Package: 225‑BBGA (27×27) package supports high I/O density in a compact footprint for space-constrained designs.
• Suitable for 5 V Systems: 4.5 V to 5.5 V supply range aligns with traditional 5 V logic platforms, simplifying power supply design.
• RoHS Compliant: Supports lead-free manufacturing processes and regulatory requirements for modern assembly lines.

Why Choose XC4010E-3BG225I?

The XC4010E-3BG225I combines a practical mix of logic elements, I/O count, and embedded RAM with an industrial temperature rating and standard 225‑BBGA packaging. It is well suited for engineers building mid-range programmable logic solutions where compact size, a high number of I/Os, and temperature resilience are important.

This device addresses designs that require reliable, reprogrammable logic capacity at 5 V system levels and provides a straightforward path for integrating custom control, interfacing, and buffering functions into a single programmable device.

Request a quote or submit a procurement inquiry today to review availability and pricing for the XC4010E-3BG225I.