XC4010XL-1TQ176I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 145 12800 950 176-LQFP |
|---|---|
| Quantity | 911 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 176-TQFP (24x24) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 176-LQFP | Number of I/O | 145 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 400 | Number of Logic Elements/Cells | 950 | ||
| Number of Gates | 10000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12800 |
Overview of XC4010XL-1TQ176I – XC4000E/X Field Programmable Gate Array (FPGA), 950 Logic Elements, 176-LQFP
The XC4010XL-1TQ176I is a Field Programmable Gate Array (FPGA) IC from the XC4000E/X family, offering a moderate logic density and on-chip memory in a surface-mount LQFP package. Key device attributes include approximately 950 logic elements, 12,800 bits of embedded RAM, and 145 user I/O pins, making it a compact, reconfigurable building block for embedded digital designs.
Engineered for industrial operating conditions, the device operates from a 3 V to 3.6 V supply and supports an operating temperature range of −40°C to 100°C. The part is RoHS compliant and supplied in a 176‑pin LQFP package suitable for surface-mount assembly.
Key Features
- Core Logic — Approximately 950 logic elements provide reconfigurable digital resources for implementing custom logic and control functions.
- Embedded Memory — 12,800 bits of on-chip RAM enable storage for configuration‑local buffers, state machines, and small data structures without external memory.
- I/O and Gate Count — 145 user I/O pins and an estimated 10,000 gates support moderate connectivity and logic capacity for mixed-signal control and interfacing tasks.
- Power — Single-supply operation from 3 V to 3.6 V simplifies integration into systems using standard 3 V logic rails.
- Package and Mounting — Surface-mount 176‑LQFP (supplier designation 176‑TQFP, 24×24) provides a compact footprint for PCB-level integration.
- Industrial Temperature Range — Rated for operation from −40°C to 100°C to meet industrial environment requirements.
- Standards Compliance — RoHS compliant for lead‑free manufacturing processes.
Unique Advantages
- Balanced logic density: ~950 logic elements deliver a midpoint option for designs that require more capability than small CPLDs but do not need high-density FPGAs.
- Integrated on-chip RAM: 12,800 bits of embedded memory reduce reliance on external RAM for small buffering and state storage.
- Substantial I/O count: 145 user I/O pins enable flexible interfacing to peripherals, sensors, and control interfaces without additional expander ICs.
- Industrial-rated operation: −40°C to 100°C temperature range and industrial grade designation support deployment in temperature-challenging environments.
- Compact surface-mount package: 176‑pin LQFP provides a high pin count in a compact footprint for space-constrained PCBs.
- RoHS compliant: Supports lead‑free manufacturing and environmental compliance requirements.
Why Choose XC4010XL-1TQ176I?
The XC4010XL-1TQ176I positions itself as a practical FPGA choice for engineers who need moderate reconfigurable logic, embedded RAM, and a large I/O complement in an industrial-rated device. With a 3 V–3.6 V supply range and operation from −40°C to 100°C, it is suited for projects that require rugged performance and a compact package.
This part is appropriate for development and production designs that demand on-chip memory and a significant number of I/O signals without moving to higher-density FPGA families. Its combination of logic elements, embedded RAM, gate count, and 176‑pin LQFP package delivers a balanced option for embedded digital applications requiring reconfigurability and industrial temperature capability.
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