XC4010XL-2BG256I

The XC4010XL-2BG256I is a field programmable gate array (FPGA) device from AMD offered in a 256-ball BGA package. It provides a mid-density programmable logic fabric with 950 logic elements, approximately 12,800 bits of on-chip RAM and up to 160 general-purpose I/O pins for custom digital designs.

Designed for systems operating from 3 V to 3.6 V and rated for industrial temperature ranges (–40 °C to 100 °C), this device suits applications that require a compact, surface-mount FPGA with a 256-PBGA (27×27) footprint and RoHS compliance.

Key Features

• Logic Core  950 logic elements provide the core programmable fabric for implementing custom digital logic functions.
• Embedded Memory  Approximately 12,800 bits of on-chip RAM allow for small data buffers, state storage and lookup tables within the FPGA fabric.
• I/O Density  Up to 160 I/O pins support interfacing to external devices and system buses for flexible system integration.
• Gate Count  Approximately 10,000 gates indicate the overall integration level available for combinational and sequential logic.
• Power  Single-supply operation from 3 V to 3.6 V simplifies power-rail requirements for compatible systems.
• Package & Mounting  256-ball BGA (supplier package: 256-PBGA, 27×27) in a surface-mount form factor enables compact board-level implementation.
• Temperature & Grade  Industrial-grade device rated for operation from –40 °C to 100 °C, suitable for temperature-demanding environments.
• Environmental Compliance  RoHS compliant to meet lead-free component requirements in regulated assemblies.

Typical Applications

• Custom logic implementations  Designs that require up to 950 logic elements and on-chip RAM for glue logic, state machines and protocol handling.
• I/O expansion and protocol bridging  Systems needing up to 160 I/O pins to interface multiple peripherals or to implement custom bus adapters.
• Industrial systems  Control and monitoring equipment that benefit from the device's industrial temperature range (–40 °C to 100 °C) and surface-mount BGA package.

Unique Advantages

• Balanced density:  950 logic elements and ~10,000 gates offer a mid-range integration point for designs that need more than small PLDs without moving to high-density FPGAs.
• Compact package:  256-BBGA (256-PBGA, 27×27) delivers a high-pin-count solution in a space-efficient surface-mount footprint.
• Flexible I/O:  160 I/O pins provide broad connectivity options for peripheral interfacing and custom bus implementations.
• Wide operating range:  Operation from 3 V to 3.6 V and –40 °C to 100 °C supports deployment in varied power and temperature environments.
• Regulatory readiness:  RoHS compliance simplifies integration into lead-free product designs and manufacturing flows.

Why Choose XC4010XL-2BG256I?

The XC4010XL-2BG256I occupies a practical position for engineers seeking a programmable logic device with moderate logic capacity, on-chip RAM and a substantial I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it appropriate for designs where environmental endurance and regulatory conformity matter.

This device is well suited to engineers and teams building custom digital logic, I/O bridging, and mid-complexity control functions who need a single-supply FPGA solution with a defined footprint and clear electrical and thermal specifications.

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