XC4010XL-3BG256C

The XC4010XL-3BG256C is a commercial‑grade Field Programmable Gate Array (FPGA) IC provided in a 256‑ball BGA package. It integrates approximately 950 logic elements and about 12,800 bits of on‑chip RAM to support programmable digital logic functions.

Designed for surface‑mount assembly and RoHS compliant, this device targets commercial electronic designs that require a moderate logic count, multi‑I/O interfacing, and a compact BGA footprint.

Key Features

• Core Logic  Approximately 950 logic elements and an estimated 10,000 equivalent gates for implementing custom digital logic and glue‑logic functions.
• Embedded Memory  Approximately 0.013 Mbits (12,800 bits) of on‑chip RAM for small data buffers, FIFOs, or state storage.
• I/O Capacity  160 user I/O pins to support multiple peripheral interfaces and parallel connections.
• Power  Supports a 3.0 V to 3.6 V supply range compatible with common commercial logic power rails.
• Package & Mounting  256‑BBGA package (supplier package listed as 256‑PBGA, 27 × 27 mm) intended for surface‑mount PCB assembly.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for use in lead‑restricted manufacturing environments.

Typical Applications

• Commercial Embedded Systems  Programmable logic for board‑level control, interfacing, and custom digital functions in commercial electronic products.
• Prototyping and Development  Hardware prototypes and proof‑of‑concept designs that require reconfigurable logic and moderate on‑chip RAM.
• Peripheral Bridging  Implementing custom bus bridges, glue logic, or I/O aggregation using the device’s 160 I/O pins and logic resources.

Unique Advantages

• Balanced Logic Density:  Approximately 950 logic elements and 10,000 gates provide a practical balance of resources for mid‑range logic implementations without excessive board area or cost.
• Compact BGA Packaging:  256‑BBGA (27 × 27 mm) enables a high pin count in a compact footprint for space‑constrained PCBs.
• Sizable I/O Count:  160 user I/O pins allow flexible interfacing to multiple peripherals or parallel bus connections, reducing the need for external multiplexers.
• On‑Chip RAM:  Approximately 0.013 Mbits of embedded RAM supports small buffers and state storage directly on the FPGA, simplifying board-level memory requirements.
• Commercial Power and Temperature Fit:  3.0–3.6 V supply and 0 °C to 85 °C operating range align with common commercial design requirements.
• RoHS Compliance:  Meets lead‑free manufacturing requirements for environmentally restricted assemblies.

Why Choose XC4010XL-3BG256C?

The XC4010XL-3BG256C positions itself as a practical, commercial‑grade FPGA for designs that need moderate programmable logic, a high number of I/O, and on‑chip RAM in a compact BGA package. Its combination of approximately 950 logic elements, 160 I/O lines, and a 256‑BBGA footprint makes it suitable for embedded system designs, prototyping, and board‑level interface functions where space and integration matter.

With RoHS compliance and a standard commercial operating range, this device offers a clear, verifiable specification set for procurement and integration into volume commercial products or development platforms.

Request a quote or submit a pricing inquiry to begin evaluating the XC4010XL-3BG256C for your next commercial FPGA design.