XC4010XL-3BG256I

The XC4010XL-3BG256I is an AMD Field Programmable Gate Array (FPGA) supplied in a 256-BBGA surface-mount package. It provides a balance of configurable logic, on-chip memory, and high I/O count suitable for industrial and embedded applications.

Key device characteristics include 950 logic elements, 12,800 bits of on-chip RAM, 160 user I/O pins, support for approximately 10,000 gates, a 3.0 V to 3.6 V supply range, and an operating temperature range of –40 °C to 100 °C.

Key Features

• Core Logic 950 logic elements (cells) supporting approximately 10,000 gates for implementing custom digital functions and glue logic.
• Embedded Memory 12,800 bits of on-chip RAM to store configuration data, small buffers, or state information within the FPGA fabric.
• High I/O Count 160 user I/O pins to interface with multiple peripherals, sensors, and external logic devices.
• Package & Mounting 256-BBGA package (supplier device package: 256-PBGA, 27 × 27 mm) in a surface-mount format for compact board integration.
• Power & Voltage Operates from 3.0 V to 3.6 V supply, enabling compatibility with common logic supply domains.
• Temperature & Grade Industrial-grade device with an operating temperature range of –40 °C to 100 °C for demanding environments.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control Used for custom control logic, state machines, and real-time interfacing in industrial automation systems that require industrial temperature operation.
• Embedded Systems Implements application-specific logic and protocol handling in embedded designs using the device’s logic elements and on-chip RAM.
• I/O-Intensive Interfaces Provides high pin count (160 I/O) for systems that need to connect multiple sensors, buses, or peripheral devices.
• Prototyping and Custom Glue Logic Suited for board-level prototyping and replacing discrete logic by consolidating functions into a single FPGA device.

Unique Advantages

• Balanced Logic Density: 950 logic elements give designers the flexibility to implement moderate-complexity designs without overprovisioning.
• Integrated Memory: 12,800 bits of embedded RAM reduce the need for external memory for small buffers and configuration storage.
• High I/O Availability: 160 I/O pins enable direct interfacing to numerous peripherals, minimizing external interface hardware.
• Compact BGA Footprint: 256-BBGA (27 × 27 mm) package delivers a compact, surface-mount solution for space-constrained PCBs.
• Industrial Reliability: Rated for –40 °C to 100 °C operation and designated industrial grade for use in harsher environments.
• RoHS Compliant: Conforms to RoHS requirements for lead-free assembly environments.

Why Choose XC4010XL-3BG256I?

The XC4010XL-3BG256I positions itself as an industrial-grade FPGA option for designs requiring a middle-ground logic capacity, substantial I/O, and on-chip RAM in a compact BGA package. Its 3.0 V–3.6 V supply range and –40 °C to 100 °C operating window make it suitable for embedded and industrial applications that demand reliable operation across extended temperature ranges.

Manufactured by AMD and provided in a 256-BBGA surface-mount package, this device is appropriate for engineers seeking to consolidate discrete logic and small memory functions into a single configurable component while maintaining compliance with RoHS directives.

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