XC4013E-2HQ208I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 160 18432 1368 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 715 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 160 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 576 | Number of Logic Elements/Cells | 1368 | ||
| Number of Gates | 13000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of XC4013E-2HQ208I – XC4000E/X Field Programmable Gate Array (FPGA) IC
The XC4013E-2HQ208I is an AMD XC4000E/X family FPGA supplied in a 208-BFQFP exposed-pad surface-mount package. It provides a mid-range programmable logic solution with 1,368 logic elements and 18,432 bits of on-chip RAM suitable for industrial applications.
With 160 user I/Os, approximately 13,000 gates of logic and an operating range from 4.5 V to 5.5 V, this device targets designs that require moderate logic density, significant I/O capability and industrial-temperature operation.
Key Features
- Logic Capacity Provides 1,368 logic elements (equivalent to approximately 13,000 gates) for implementing custom digital functions and control logic.
- Embedded Memory Includes 18,432 bits of on-chip RAM to support local buffering, state storage and small lookup tables.
- I/O Offers 160 user I/O pins to accommodate a wide range of parallel interfaces and signal routing needs.
- Power Operates from a 4.5 V to 5.5 V supply range to match legacy and industrial power domains.
- Package & Mounting Supplied in a 208-BFQFP exposed-pad, surface-mount package (supplier device package: 208-PQFP 28×28) for board-level integration and thermal management.
- Temperature Grade Industrial operating range from −40 °C to 100 °C for deployment in temperature-variable environments.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Industrial-grade qualification and temperature range make this FPGA suitable for general industrial control logic and interface glue in automation equipment.
- I/O-Intensive Designs With 160 user I/Os, the device supports systems that require extensive parallel signal connectivity or multiple external peripherals.
- Embedded Logic Functions 1,368 logic elements and 18,432 bits of RAM enable implementation of custom state machines, data path logic and small embedded processors.
Unique Advantages
- Balanced Logic and Memory Combines 1,368 logic elements with 18,432 bits of on-chip RAM to implement both control and data buffering in a single device.
- High I/O Count 160 user I/Os reduce the need for external I/O expanders and simplify board-level routing for multi-signal designs.
- Industrial Temperature Range Rated from −40 °C to 100 °C to support deployment in environments with wide temperature variation.
- Standard 5 V Power Domain Operates on a 4.5 V to 5.5 V supply range for compatibility with common industrial power rails.
- Compact Surface-Mount Package 208-BFQFP exposed-pad format provides a compact footprint with improved thermal dissipation for board-level integration.
- RoHS Compliant Meets RoHS environmental requirements for lead-free assemblies.
Why Choose XC4013E-2HQ208I?
The XC4013E-2HQ208I positions itself as a reliable, industrial-grade FPGA option that balances moderate logic density with ample I/O and on-chip memory. Its combination of 1,368 logic elements, 18,432 bits of embedded RAM and 160 I/Os makes it well suited for industrial control, interface-rich systems and embedded logic implementations that operate on standard 5 V power rails.
Manufactured by AMD and delivered in a 208-BFQFP exposed-pad surface-mount package, the device offers a practical integration path for engineers seeking predictable thermal behavior, RoHS compliance and support for designs operating from −40 °C to 100 °C.
Request a quote or submit an inquiry to receive pricing and availability information for the XC4013E-2HQ208I.

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