XC4013E-2PG223I

IC FPGA 192 I/O 223CPGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 192 18432 1368 223-BCPGA

Quantity 1,097 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package223-CPGA (47.24x47.24)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case223-BCPGANumber of I/O192Voltage4.5 V - 5.5 V
Mounting MethodThrough HoleRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates13000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XC4013E-2PG223I – XC4000E/X Field Programmable Gate Array (FPGA) IC 223-BCPGA

The XC4013E-2PG223I is an FPGA from AMD's XC4000E/X family, offering mid-range programmable logic and embedded RAM for industrial applications. With 1,368 logic elements, 18,432 bits of on-chip RAM and 192 user I/Os, this device is suited for designs that require flexible digital implementation and substantial I/O connectivity.

Packaged in a 223-pin BCPGA (223-CPGA, 47.24×47.24 mm) and rated for industrial temperature and RoHS compliance, the part supports systems operating from a 4.5 V to 5.5 V supply and an operating range of −40 °C to 100 °C.

Key Features

  • Logic Capacity  Provides 1,368 logic elements, enabling implementation of custom combinational and sequential logic within a mid-range FPGA fabric.
  • Embedded Memory  Approximately 18,432 bits of on-chip RAM for data buffering, small lookup tables, and state storage.
  • I/O Density  192 user I/O pins for broad interfacing with external devices, buses, and peripherals.
  • Gate Equivalent  Approximately 13,000 gates for estimating integration of legacy logic designs.
  • Power  Operates from a 4.5 V to 5.5 V supply, compatible with standard 5 V system rails.
  • Package & Mounting  223-BCPGA package (223-CPGA, 47.24×47.24 mm) in a through-hole mounting format for robust board-level assembly and prototyping.
  • Industrial Temperature Range  Specified for −40 °C to 100 °C operation, supporting deployment in temperature-challenging environments.
  • Compliance  RoHS-compliant construction to meet environmental and manufacturing requirements.

Typical Applications

  • Industrial Control  Custom control logic, state machines and signal processing functions leveraging the device's logic density and I/O count for machinery and automation systems.
  • Embedded Systems  Mid-range embedded designs that require on-chip RAM and flexible I/O mapping for interfacing sensors, actuators, and peripheral buses.
  • Prototyping and Development  Through-hole package and accessible I/O make it suitable for development boards and early-stage hardware validation.
  • Custom Interfaces  Implement glue logic, protocol bridging or bus adaptation where a mix of logic resources and abundant I/O is needed.

Unique Advantages

  • Balanced Logic and Memory:  1,368 logic elements combined with approximately 18,432 bits of embedded RAM provide a practical balance for mid-range digital designs.
  • High I/O Count:  192 user I/Os reduce external buffering and simplify board-level routing for complex interfacing requirements.
  • Industrial Reliability:  Operation across −40 °C to 100 °C supports deployment in industrial environments with extended temperature demands.
  • Standard 5 V Compatibility:  4.5 V to 5.5 V supply range allows integration into systems using standard 5 V power rails without additional level conversion for VCC.
  • Through-Hole Robustness:  Through-hole BCPGA mounting provides mechanical stability for development platforms and boards subject to handling or thermal cycling.
  • Environmental Compliance:  RoHS compliance aligns with modern manufacturing and procurement requirements.

Why Choose XC4013E-2PG223I?

XC4013E-2PG223I positions itself as a reliable, industrial-grade FPGA option for engineers seeking a mid-range programmable logic device with substantial I/O and modest embedded memory. Its specification set—1,368 logic elements, 18,432 bits of RAM, 192 I/Os, and operation over −40 °C to 100 °C—makes it well suited for industrial control, embedded systems, and prototyping where 5 V compatibility and through-hole packaging are desirable.

Manufactured by AMD and provided in a 223-BCPGA package, this FPGA offers designers a pragmatic combination of integration, I/O flexibility, and environmental tolerance for projects that require dependable digital customization and board-level robustness.

Request a quote or submit an inquiry for XC4013E-2PG223I to get pricing and availability for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up