XC4013XL-1HT176C

IC FPGA 145 I/O 176TQFP
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 145 18432 1368 176-LQFP Exposed Pad

Quantity 1,026 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package176-TQFP (24x24)GradeCommercialOperating Temperature0°C – 85°C
Package / Case176-LQFP Exposed PadNumber of I/O145Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates13000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XC4013XL-1HT176C – XC4000E/X Field Programmable Gate Array (FPGA), 176-LQFP Exposed Pad

The XC4013XL-1HT176C is a commercial-grade FPGA from AMD's XC4000E/X family, supplied in a 176-LQFP exposed pad package. It delivers medium-density programmable logic suitable for commercial applications that require a balance of logic capacity, on-chip memory, and a generous number of I/O pins.

Key device characteristics include 1,368 logic elements, approximately 18,432 bits of embedded RAM, up to 145 user I/O pins, and an operating voltage range of 3.0 V to 3.6 V, making it a practical choice for designs constrained by board space and standard commercial temperature profiles.

Key Features

  • Core Logic 1,368 logic elements provide medium-density programmable logic resources for implementing custom digital functions.
  • Embedded Memory Approximately 18,432 bits of on-chip RAM to support local buffering, state storage, and small lookup tables.
  • I/O Capacity Up to 145 user I/O pins to accommodate multiple external interfaces and peripheral connections.
  • Gate Equivalence Equivalent to approximately 13,000 gates for estimating legacy gate-count requirements.
  • Power Operates from a 3.0 V to 3.6 V supply range, compatible with common commercial power rails.
  • Package & Mounting Supplied in a 176-LQFP exposed pad package (supplier package listed as 176-TQFP, 24 × 24), designed for surface-mount assembly.
  • Operating Range Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance RoHS compliant for environmentally conscious assembly and supply-chain requirements.

Typical Applications

  • Commercial control and interface designs — Use the device’s 145 I/O pins and 1,368 logic elements to implement sensor interfacing, protocol translation, and control logic in commercial systems.
  • Glue logic and peripheral aggregation — Replace multiple discrete components by consolidating glue logic and peripheral interfaces within the FPGA’s programmable fabric and embedded memory.
  • Prototyping and evaluation — Medium-density resources and standard 176-LQFP packaging support board-level development and evaluation for commercial product concepts.

Unique Advantages

  • Right-sized capacity: 1,368 logic elements and ~18,432 bits of RAM provide a balance between functionality and cost for medium-complexity designs.
  • Generous I/O: 145 available I/O pins allow consolidation of multiple external interfaces without immediate need for additional I/O expanders.
  • Standard packaging: 176-LQFP exposed pad in a 24 × 24 footprint supports surface-mount assembly and heat dissipation considerations for commercial PCBs.
  • Commercial temperature design: Rated 0 °C to 85 °C to match typical commercial application environments.
  • RoHS compliant: Meets common environmental requirements for modern electronic assembly.

Why Choose XC4013XL-1HT176C?

The XC4013XL-1HT176C positions itself as a medium-density, commercial-grade FPGA that combines a practical count of logic elements, embedded RAM, and extensive I/O in a compact surface-mount package. It is well suited to designers who need to implement custom digital logic, consolidate peripheral interfaces, or evaluate commercial product concepts without stepping up to larger-capacity devices.

Manufactured by AMD and supplied in a 176-LQFP exposed pad package, this device offers predictable electrical and thermal characteristics for commercial boards powered from a 3.0–3.6 V supply and operating within standard commercial temperature limits.

Request a quote or submit a purchase inquiry to receive pricing and availability for the XC4013XL-1HT176C. Include quantity and required delivery timeframe to expedite response.

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