XC4013XL-1BG256I

The XC4013XL-1BG256I is an AMD XC4000E/X series Field Programmable Gate Array (FPGA) presented in a compact 256-ball BGA package. It provides a balance of on-chip logic, embedded RAM, and a broad I/O count for configurable digital designs, with industrial-grade temperature tolerance and a common 3.0–3.6 V supply range.

Key Features

• Core Logic — 576 configurable logic blocks (CLBs) and 1,368 logic elements deliver flexible, user-defined digital logic implementation for a variety of control and glue-logic tasks.
• Embedded Memory — 18,432 bits of on-chip RAM provide local storage for buffering, state machines, and small data structures without external memory.
• I/O and Gate Count — 192 I/O pins and approximately 13,000 gates support dense peripheral connectivity and moderate combinational/sequential logic capacity.
• Power — Operates from a 3.0 V to 3.6 V supply, matching common system power rails for straightforward integration.
• Package & Mounting — Surface-mount 256-BBGA (supplier package: 256-PBGA, 27 × 27 mm) minimizes PCB footprint while supporting reliable board-level assembly.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environments.
• Environmental Compliance — RoHS compliant, enabling use in assemblies that require lead-free components.

Typical Applications

• Industrial Control — Implement custom control logic, sequencing, and interface bridging in industrial automation hardware that requires an industrial temperature range.
• Embedded Systems — Provide programmable glue logic, peripheral management, and small on-chip buffering for compact embedded designs.
• Interface and I/O Expansion — Use the 192 I/O pins to build custom I/O interfaces, protocol translators, or signal aggregation modules.
• Prototyping and Low- to Mid-density Logic — Fast iteration of hardware logic functions and validation of digital designs requiring moderate logic and memory resources.

Unique Advantages

• Balanced Logic Density: 1,368 logic elements and ~13,000 gates provide a practical mid-range capacity for a wide set of configurable functions without excessive complexity.
• Substantial On-Chip RAM: 18,432 bits of embedded RAM reduce dependence on external memory for control and buffering tasks, simplifying BOM and board routing.
• High I/O Count: 192 I/O pins enable direct connections to multiple peripherals and interfaces, minimizing the need for additional bus extenders or controllers.
• Industrial Robustness: −40 °C to 100 °C operating range and industrial grade specification support deployment in temperature-challenging environments.
• Compact BGA Package: 256-BBGA (27 × 27 mm) supports dense PCB designs while maintaining reliable surface-mount assembly characteristics.
• RoHS Compliance: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose XC4013XL-1BG256I?

The XC4013XL-1BG256I combines moderate logic capacity, meaningful embedded RAM, and a high I/O count in a compact 256-BBGA package, making it well suited for engineers designing industrial and embedded systems that need configurable digital logic with a small footprint. Its industrial temperature rating and standard 3.0–3.6 V supply simplify integration into systems that require robustness and straightforward power design.

This FPGA is a practical choice for teams seeking a reliable, mid-density programmable logic device from a recognized manufacturer, offering on-chip resources that reduce external component needs and support scalable, maintainable designs.

Request a quote today to obtain pricing and lead-time information for the XC4013XL-1BG256I and to discuss how it can fit into your next FPGA-based design.