XC4013XL-09PQ240C

IC FPGA 192 I/O 240QFP
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP

Quantity 33 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O192Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates13000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XC4013XL-09PQ240C – XC4000E/X FPGA, 192 I/O, 1368 logic elements

The XC4013XL-09PQ240C is a field programmable gate array (FPGA) IC from AMD within the XC4000E/X family. It provides programmable logic resources and on-chip RAM to implement custom digital functions and interfacing in surface-mount form.

With 1,368 logic elements, 18,432 bits of embedded memory and 192 user I/O pins in a 240-pin PQFP package, this device targets designs that require moderate logic capacity combined with substantial I/O and a standard commercial operating range.

Key Features

  • Core Logic — 1,368 logic elements for implementing custom combinational and sequential logic functions.
  • Embedded Memory — 18,432 bits of on-chip RAM for local buffering, state storage, and small lookup tables.
  • I/O Capacity — 192 user I/O pins to support complex interfacing and multi-signal connectivity.
  • Gate Equivalent — Approximately 13,000 gates of logic equivalent to quantify device capacity for architectural planning.
  • Package & Mounting — 240-BFQFP / 240-PQFP (32 × 32) package in a surface-mount form factor for PCB assembly.
  • Power — Operates from a 3.0 V to 3.6 V supply range, compatible with common 3.3 V systems.
  • Temperature Range — Commercial grade operation from 0 °C to 85 °C.
  • Environmental — RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

  • Prototyping and development: Use the FPGA to validate custom logic and iterate hardware designs with on-chip memory for temporary data storage.
  • I/O-intensive interface bridging: Leverage 192 I/O pins to connect multiple peripherals or bridge bus standards within a single device.
  • Embedded control logic: Implement control, sequencing, and glue-logic functions that benefit from reconfigurability and local RAM.

Unique Advantages

  • Balanced logic and memory: 1,368 logic elements combined with 18,432 bits of embedded RAM enable compact implementations of moderately complex functions without external memory.
  • High I/O count: 192 I/O pins simplify board-level integration when multiple signals or parallel interfaces are required.
  • Standard surface-mount package: 240-pin PQFP footprint supports conventional SMT assembly and straightforward PCB layout.
  • 3.0–3.6 V operation: Matches common 3.3 V system rails for ease of power integration.
  • Commercial temperature rating: 0 °C to 85 °C suits a wide range of consumer and industrial-adjacent applications.
  • RoHS compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose XC4013XL-09PQ240C?

The XC4013XL-09PQ240C delivers a practical combination of programmable logic, embedded RAM, and a high I/O count in a 240-pin PQFP surface-mount package. Its electrical and thermal specifications align with typical 3.3 V commercial designs, making it a straightforward option for engineers needing moderate logic density and extensive connectivity.

This device is well suited for designs that require reprogrammable logic, local memory resources and broad interfacing capability while maintaining RoHS compliance and standard surface-mount assembly compatibility.

Request a quote or submit a quote to obtain pricing and availability for the XC4013XL-09PQ240C.

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