XC4013XL-09BG256C

IC FPGA 192 I/O 256BGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 192 18432 1368 256-BBGA

Quantity 265 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BBGANumber of I/O192Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates13000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XC4013XL-09BG256C – XC4000E/X Field Programmable Gate Array (FPGA) IC 192 18432 1368 256-BBGA

The XC4013XL-09BG256C is a programmable logic device from the XC4000E/X family intended for commercial embedded logic designs. It provides a mid-range balance of configurable logic, on-chip RAM, and I/O resources for applications that require flexible digital implementation in a surface-mount BGA package.

Key Features

  • Core Logic  576 CLBs and 1,368 logic elements (cells) delivering approximately 13,000 gates of programmable logic for implementing custom digital functions.
  • Embedded Memory  18,432 bits of on-chip RAM for local buffering, state storage, and small data structures without external memory.
  • I/O Capacity  192 user I/O pins to support multiple interfaces, peripheral connections, and board-level signal routing.
  • Package & Mounting  256-BBGA package; supplier device package listed as 256-PBGA (27×27). Surface-mount mounting type suitable for compact PCB layouts.
  • Power  Operates from a 3.0 V to 3.6 V supply range, compatible with common 3.3 V system rails.
  • Operating Range & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
  • Regulatory Compliance  RoHS compliant.

Typical Applications

  • Embedded Control  Implement custom control logic and state machines using the available CLBs and logic elements to offload tasks from microcontrollers.
  • Interface Bridging  Use the 192 I/O pins for protocol conversion, signal translation, and glue-logic between digital subsystems.
  • Prototyping and Development  Evaluate and iterate digital designs that require moderate amounts of programmable logic and on-chip RAM.

Unique Advantages

  • Balanced logic density: 576 CLBs and 1,368 logic elements provide a practical resource set for mid-complexity designs without excessive device cost.
  • Integrated on-chip RAM: 18,432 bits of embedded memory reduce dependence on external memories for small buffers and state storage.
  • High I/O count in a compact package: 192 I/Os in a 256-BBGA footprint enable dense connectivity for peripherals and board-level interfaces.
  • Standard commercial qualification: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial products and environments.
  • RoHS compliant: Conforms to lead-free and hazardous substance regulations required in many procurement programs.

Why Choose XC4013XL-09BG256C?

The XC4013XL-09BG256C offers a compact, mid-range FPGA solution providing a blend of programmable logic, embedded RAM, and abundant I/O in a 256-BBGA surface-mount package. Its 3.0–3.6 V supply range and commercial temperature rating make it suitable for standard commercial embedded systems that require configurable digital functionality.

Manufactured by AMD and drawn from the XC4000E/X family, this device is appropriate for designers seeking a commercially graded FPGA option with clearly specified logic, memory, and I/O resources for prototyping, interface control, and embedded logic tasks.

Request a quote or submit an inquiry to obtain pricing, lead-time, and availability for the XC4013XL-09BG256C.

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