XC4013XL-09HT176C

The XC4013XL-09HT176C is a commercial-grade Field Programmable Gate Array (FPGA) IC from AMD in a 176-LQFP exposed pad package. It provides a mid-range logic resource set including 1,368 logic elements, approximately 18,432 bits of on-chip RAM and roughly 13,000 gates, along with 145 I/O pins for flexible interfacing.

Designed for commercial electronic designs requiring moderate on-chip logic and memory capacity, this surface-mount FPGA supports a 3.0–3.6 V supply and an operating temperature range of 0 °C to 85 °C, while meeting RoHS compliance requirements.

Key Features

• Core Logic  Contains 1,368 logic elements and approximately 13,000 gates to implement custom combinational and sequential logic functions.
• Embedded Memory  Provides approximately 18,432 bits of on-chip RAM for data buffering, small LUT storage and state retention within designs.
• I/O Density  145 user I/O pins enable a wide range of external interfaces and parallel signal connections for typical commercial applications.
• Power Supply  Operates from 3.0 V to 3.6 V supply voltage, enabling integration into common commercial power domains.
• Package & Mounting  Available in a 176-LQFP exposed pad package (supplier device package: 176-TQFP, 24×24) with surface-mount mounting for compact PCB layouts and thermal conduction through the exposed pad.
• Environmental & Grade  Commercial-grade device with RoHS compliance and an ambient operating temperature range of 0 °C to 85 °C suitable for standard commercial applications.

Typical Applications

• Commercial Embedded Systems  Use the FPGA’s 1,368 logic elements and 145 I/Os to implement control logic, peripheral interfacing and custom timing in commercial electronic products.
• Interface Bridging  Leverage the high I/O count to create protocol adapters, bus interfaces or custom glue logic between subsystems.
• Prototyping and Development  A mid-range resource set makes this device suitable for design validation and functional prototyping where on-chip RAM and configurable logic are required.
• I/O Expansion and Control  Deploy the device to expand digital I/O capacity and implement application-specific control functions within a commercial operating environment.

Unique Advantages

• Balanced Logic and Memory  Combines 1,368 logic elements with approximately 18,432 bits of RAM to support moderate complexity designs without external memory in many use cases.
• High I/O Count  145 I/Os provide flexible connectivity options, reducing the need for additional interface components.
• Standard Commercial Qualification  Commercial-grade temperature range (0 °C to 85 °C) aligns with typical commercial product requirements.
• Compact Surface-Mount Package  176-LQFP exposed pad in a 24×24 supplier footprint supports dense PCB layouts and improved thermal conduction through the pad.
• RoHS Compliant  Meets RoHS environmental standards for lead-free assembly and regulatory alignment in commercial products.

Why Choose XC4013XL-09HT176C?

The XC4013XL-09HT176C delivers a practical balance of logic, memory and I/O in a commercial-grade FPGA package from AMD. Its combination of 1,368 logic elements, approximately 18,432 bits of on-chip RAM, 145 I/Os and a 3.0–3.6 V supply range makes it well suited for commercial embedded designs that require moderate configurability and interface density.

Engineers selecting this FPGA can expect a compact surface-mount footprint (176-LQFP exposed pad) and RoHS compliance for integration into standard commercial product assemblies. It is appropriate for projects where midsize programmable logic capability and flexible I/O counts are priorities.

Request a quote or submit an inquiry to receive pricing and availability information for the XC4013XL-09HT176C. Our team can provide lead-time details and support for your procurement and design planning.