XC4020E-3HQ240C

IC FPGA 193 I/O 240QFP
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 193 25088 1862 240-BFQFP Exposed Pad

Quantity 1,655 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O193Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs784Number of Logic Elements/Cells1862
Number of Gates20000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits25088

Overview of XC4020E-3HQ240C – XC4000E/X FPGA, 240-BFQFP Exposed Pad

The XC4020E-3HQ240C is an AMD Field Programmable Gate Array (FPGA) offered in a 240-BFQFP exposed pad surface-mount package. It provides a moderate density of programmable logic, on-chip RAM and a high I/O count for commercial electronic designs.

Key device resources include 1,862 logic elements (approximately 20,000 equivalent gates), 25,088 bits of embedded RAM and 193 I/O pins, with a 4.75 V to 5.25 V supply range and a commercial operating temperature of 0 °C to 85 °C.

Key Features

  • Core Logic — 1,862 logic elements and approximately 20,000 equivalent gates for implementing custom digital functions.
  • Embedded Memory — 25,088 bits of on-chip RAM to support local data storage and buffering within the FPGA.
  • I/O Capacity — 193 available I/O pins to accommodate numerous external interfaces and peripherals.
  • Package & Mounting — 240-BFQFP exposed pad package (supplier device package: 240-PQFP 32×32) designed for surface-mount assembly.
  • Power — Single supply operation with a voltage range of 4.75 V to 5.25 V for straightforward power integration.
  • Operating Range & Grade — Commercial grade device specified for 0 °C to 85 °C operation.
  • Environment — RoHS compliant.

Typical Applications

  • Programmable Logic Integration — Implements glue logic and custom digital functions where moderate logic density and embedded RAM are required.
  • I/O-Intensive Embedded Systems — Supports designs that require numerous external connections through its 193 I/O pins.
  • On-Chip Data Buffering — Uses the 25,088 bits of embedded RAM for local buffering and small data storage tasks within digital designs.

Unique Advantages

  • High I/O Count: 193 I/O pins enable broad external connectivity without immediate need for additional I/O expanders.
  • Balanced Logic Density: 1,862 logic elements and ~20,000 gates offer a mid-range programmable resource set suitable for many commercial applications.
  • Integrated On-Chip RAM: 25,088 bits of embedded RAM reduce dependency on external memory for localized storage and buffering.
  • Standard 5 V Supply: 4.75 V to 5.25 V operating range simplifies integration into systems using 5 V rails.
  • Compact Surface-Mount Package: 240-BFQFP exposed pad provides a compact footprint for PCB-mounted designs.
  • RoHS Compliant: Meets common environmental compliance expectations for commercial products.

Why Choose XC4020E-3HQ240C?

The XC4020E-3HQ240C positions itself as a commercially graded FPGA with a practical mix of logic, memory and I/O resources. Its 1,862 logic elements, 25,088 bits of embedded RAM and 193 I/O pins make it suitable for commercial embedded designs that require programmable logic alongside substantial external interfacing, all in a compact 240-BFQFP exposed pad package.

Manufactured by AMD, this device is intended for design teams seeking a mid-range FPGA option that balances integration, I/O capability and straightforward 5 V power requirements for commercial temperature environments.

Request a quote or submit an inquiry to receive pricing and availability information for the XC4020E-3HQ240C.

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