XC4020E-3PG223C

The XC4020E-3PG223C is a field programmable gate array (FPGA) IC from AMD in a 223-BCPGA package. It provides a moderate logic capacity and a large I/O complement for commercial embedded designs that require flexible, reprogrammable digital logic.

With 1,862 logic elements, approximately 25 kbits of on-chip RAM and 192 user I/O pins, this device is targeted at designers implementing custom control, interfacing and glue-logic functions where a through-hole 223-CPGA package and a 5 V supply are required.

Key Features

• Logic Fabric  1,862 logic elements organized into 784 logic array blocks for implementing combinational and sequential logic.
• Gate Count  Approximately 20,000 equivalent gates to support moderate-density designs.
• Embedded Memory  Total on-chip RAM of 25,088 bits (approximately 25 kbits) for small data storage and buffering needs.
• I/O  192 user-accessible I/O pins to support wide parallel interfacing and multiple peripheral connections.
• Power  Single-supply operation from 4.75 V to 5.25 V for designs using legacy 5 V logic domains.
• Package & Mounting  223-BCPGA package, supplier device package 223-CPGA with a 47.24 × 47.24 mm footprint; through-hole mounting for prototyping and board-level serviceability.
• Temperature & Grade  Commercial operating temperature range of 0 °C to 85 °C; graded for commercial applications.
• Compliance  RoHS compliant.

Typical Applications

• Custom Digital Logic and Prototyping  Implement and iterate on medium-complexity digital designs using reprogrammable logic and on-chip RAM.
• Interface Bridging and I/O Expansion  Use the 192 I/O pins to bridge protocols or expand board-level connectivity without adding multiple discrete ICs.
• Embedded Control and Sequencing  Provide control, state machines and glue logic for commercial embedded equipment operating within a 0 °C to 85 °C range.
• Board-Level Development and Lab Use  Through-hole 223-CPGA packaging facilitates hand assembly, socketing and iterative hardware development.

Unique Advantages

• High I/O Density: 192 user I/O pins enable flexible interfacing to multiple peripherals and parallel buses.
• Balanced Logic and Memory: 1,862 logic elements combined with approximately 25 kbits of RAM support a range of moderate-complexity designs without external memory.
• Through-Hole 223-CPGA Package: The 47.24 × 47.24 mm CPGA footprint and through-hole mounting simplify prototyping, socket use and board-level servicing.
• 5 V Supply Compatibility: Operation from 4.75 V to 5.25 V fits systems using legacy 5 V domains, reducing the need for additional level-shifting power architecture.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial products and development environments.
• RoHS Compliant: Meets lead-free and restricted-material requirements for regulated markets.

Why Choose XC4020E-3PG223C?

The XC4020E-3PG223C delivers a practical combination of logic capacity, embedded memory and high I/O count in a serviceable 223-BCPGA through-hole package. It is well suited for designers who need reprogrammable logic for custom digital functions, interface bridging, and board-level prototyping within commercial temperature limits.

Its 5 V supply compatibility, RoHS compliance and clearly defined package footprint make it a pragmatic choice for commercial embedded projects where maintainability and moderate logic density are primary considerations.

Request a quote or submit an inquiry to receive pricing and availability for the XC4020E-3PG223C and to discuss suitability for your next design.