XC4020XL-1BG256I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 205 25088 1862 256-BBGA |
|---|---|
| Quantity | 587 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BBGA | Number of I/O | 205 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 784 | Number of Logic Elements/Cells | 1862 | ||
| Number of Gates | 20000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 25088 |
Overview of XC4020XL-1BG256I – XC4000E/X Field Programmable Gate Array (FPGA), 256-BBGA
The XC4020XL-1BG256I is a Field Programmable Gate Array (FPGA) IC from AMD's XC4000E/X family, offered in a 256‑BBGA package. It provides a hardware-configurable fabric with 1,862 logic elements, 20,000 gates and 205 I/O pins for custom digital logic implementations.
Designed as an industrial‑grade device, the part supports a single supply range of 3 V to 3.6 V and an operating temperature range of −40 °C to 100 °C, making it suitable for systems requiring robustness across extended temperature environments.
Key Features
- Core Logic 1,862 logic elements and approximately 20,000 equivalent gates to implement custom combinational and sequential logic.
- Embedded Memory 25,088 bits of on-chip RAM (approximately 0.0251 Mbits) for distributed storage and buffering inside the FPGA fabric.
- I/O Capacity 205 user I/O pins to interface with peripherals, sensors and external logic.
- Power Single-supply operation from 3 V to 3.6 V to match common system power rails.
- Package and Mounting Surface-mount 256‑BBGA package (supplier device package: 256‑PBGA, 27×27 mm) for compact board-level integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Regulatory Compliance RoHS‑compliant material status.
Unique Advantages
- High integration density: 1,862 logic elements and ~20,000 gates consolidate custom logic that would otherwise require multiple discrete devices.
- Significant I/O count: 205 I/O pins enable direct interfacing to a wide range of external components without additional I/O expansion.
- On-chip memory: 25,088 bits of embedded RAM provide local buffering and state storage, reducing external memory dependence.
- Industrial robustness: Operation from −40 °C to 100 °C supports designs that must perform reliably across extended temperature ranges.
- Compact board footprint: 256‑BBGA / 256‑PBGA (27×27) package simplifies board routing while keeping the solution space-efficient.
- RoHS compliance: Meets material requirements for RoHS‑restricted applications.
Why Choose XC4020XL-1BG256I?
The XC4020XL-1BG256I offers a balanced combination of logic capacity, I/O count and embedded RAM in a compact, industrial-grade package. Its single-supply 3 V to 3.6 V operation and wide temperature rating make it appropriate for systems that demand dependable performance across varying environments.
This device is well suited to engineers and procurement teams seeking a programmable logic solution that provides on-chip memory, broad I/O connectivity and a compact surface-mount package, delivering long-term design flexibility and integration potential within constrained board areas.
Request a quote or submit an RFQ to receive pricing and availability information for XC4020XL-1BG256I.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








