XC4020XL-1BG256I

IC FPGA 205 I/O 256BGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 205 25088 1862 256-BBGA

Quantity 587 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BBGANumber of I/O205Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs784Number of Logic Elements/Cells1862
Number of Gates20000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits25088

Overview of XC4020XL-1BG256I – XC4000E/X Field Programmable Gate Array (FPGA), 256-BBGA

The XC4020XL-1BG256I is a Field Programmable Gate Array (FPGA) IC from AMD's XC4000E/X family, offered in a 256‑BBGA package. It provides a hardware-configurable fabric with 1,862 logic elements, 20,000 gates and 205 I/O pins for custom digital logic implementations.

Designed as an industrial‑grade device, the part supports a single supply range of 3 V to 3.6 V and an operating temperature range of −40 °C to 100 °C, making it suitable for systems requiring robustness across extended temperature environments.

Key Features

  • Core Logic  1,862 logic elements and approximately 20,000 equivalent gates to implement custom combinational and sequential logic.
  • Embedded Memory  25,088 bits of on-chip RAM (approximately 0.0251 Mbits) for distributed storage and buffering inside the FPGA fabric.
  • I/O Capacity  205 user I/O pins to interface with peripherals, sensors and external logic.
  • Power  Single-supply operation from 3 V to 3.6 V to match common system power rails.
  • Package and Mounting  Surface-mount 256‑BBGA package (supplier device package: 256‑PBGA, 27×27 mm) for compact board-level integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Regulatory Compliance  RoHS‑compliant material status.

Unique Advantages

  • High integration density: 1,862 logic elements and ~20,000 gates consolidate custom logic that would otherwise require multiple discrete devices.
  • Significant I/O count: 205 I/O pins enable direct interfacing to a wide range of external components without additional I/O expansion.
  • On-chip memory: 25,088 bits of embedded RAM provide local buffering and state storage, reducing external memory dependence.
  • Industrial robustness: Operation from −40 °C to 100 °C supports designs that must perform reliably across extended temperature ranges.
  • Compact board footprint: 256‑BBGA / 256‑PBGA (27×27) package simplifies board routing while keeping the solution space-efficient.
  • RoHS compliance: Meets material requirements for RoHS‑restricted applications.

Why Choose XC4020XL-1BG256I?

The XC4020XL-1BG256I offers a balanced combination of logic capacity, I/O count and embedded RAM in a compact, industrial-grade package. Its single-supply 3 V to 3.6 V operation and wide temperature rating make it appropriate for systems that demand dependable performance across varying environments.

This device is well suited to engineers and procurement teams seeking a programmable logic solution that provides on-chip memory, broad I/O connectivity and a compact surface-mount package, delivering long-term design flexibility and integration potential within constrained board areas.

Request a quote or submit an RFQ to receive pricing and availability information for XC4020XL-1BG256I.

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