XC4020XL-1PQ160C

IC FPGA 129 I/O 160QFP
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 129 25088 1862 160-BQFP

Quantity 431 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package160-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case160-BQFPNumber of I/O129Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs784Number of Logic Elements/Cells1862
Number of Gates20000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits25088

Overview of XC4020XL-1PQ160C – XC4000E/X FPGA, 1862 logic elements, 129 I/O, 160-BQFP

The XC4020XL-1PQ160C is a Field Programmable Gate Array (FPGA) in AMD's XC4000E/X family, provided in a surface-mount 160-BQFP package. It delivers moderate logic density with 1,862 logic elements, 25,088 bits of on-chip RAM and 129 user I/O lines, suited to commercial embedded and general-purpose digital designs.

Designed for 3.0 V to 3.6 V systems and a commercial operating range of 0 °C to 85 °C, this device is appropriate where balanced logic capacity, flexible I/O and compact packaging are priorities.

Key Features

  • Logic Capacity — 1,862 logic elements provide a moderate amount of programmable logic for encoding state machines, glue logic and mid-density combinational/sequential logic networks.
  • On-Chip Memory — 25,088 bits of embedded RAM for small data buffers, FIFOs or state storage.
  • I/O — 129 user I/O pins to support multiple interfaces and parallel connections without external I/O expander components.
  • Gate Count — 20,000 gates of equivalent logic density for planning resource allocation and partitioning between logic and memory needs.
  • Power and Voltage — Operates from 3 V to 3.6 V supply rails, enabling integration into standard 3.3 V systems.
  • Package and Mounting — Available in a 160-BQFP surface-mount package (supplier device package: 160-PQFP, 28 × 28 mm), supporting compact board layouts.
  • Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operation.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

  • Commercial Embedded Systems — Implement control logic, protocol handling and custom datapaths in mid-range embedded products where commercial-grade components are appropriate.
  • Interface and Glue Logic — Replace multiple discrete devices by consolidating glue logic, bus interfacing and signal steering using the device’s 129 I/O pins.
  • Prototyping and Development — Validate digital designs and iterate on logic implementations using a mid-density FPGA resource set.
  • I/O-Intensive Control — Manage parallel sensors, actuators or peripheral buses that require numerous programmable I/O lines.

Unique Advantages

  • Balanced Logic Density: 1,862 logic elements and 20,000 gates provide a practical trade-off between capability and board-level cost for many commercial designs.
  • Ample I/O Count: 129 user I/O pins reduce the need for external buffers or expanders, simplifying board routing and BOM.
  • On-Chip Memory: 25,088 bits of embedded RAM enable local buffering and small data structures without additional external memory.
  • Compact Surface-Mount Package: 160-BQFP (160-PQFP, 28 × 28 mm) supports space-constrained layouts while remaining solderable by standard SMT processes.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for typical commercial deployment scenarios.
  • RoHS Compliance: Meets lead-free and environmental compliance requirements for modern assembly standards.

Why Choose XC4020XL-1PQ160C?

The XC4020XL-1PQ160C is positioned for designers needing a commercially graded FPGA with a moderate mix of logic, embedded RAM and a high I/O count in a compact surface-mount package. Its specifications—1,862 logic elements, 25,088 bits of on-chip RAM and 129 I/O—make it suitable for consolidating glue logic, implementing control functions and supporting I/O-heavy designs without excessive board complexity.

Manufactured by AMD, the device provides a clear specification set for evaluating fit in mid-range commercial applications where voltage, temperature and package constraints are defined. It offers a pragmatic balance of integration and predictability for engineering teams refining digital designs and production BOMs.

Request a quote or submit a parts inquiry to receive pricing, availability and lead-time information for the XC4020XL-1PQ160C.

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