XC4020XL-3BG256I

The XC4020XL-3BG256I is a Field Programmable Gate Array (FPGA) IC from AMD, offered in a 256‑ball BGA package. It delivers mid-range programmable logic capacity with integrated on‑chip RAM and a substantial I/O count, packaged and specified for industrial temperature operation.

This device is targeted at designs that require configurable digital logic, embedded memory, and broad I/O connectivity while operating from a 3.0 V to 3.6 V supply and across an industrial temperature range.

Key Features

• Programmable logic capacity  Approximately 1,862 logic elements providing the reconfigurable fabric for implementing custom digital functions.
• Gate-equivalent scale  Approximately 20,000 gates, enabling mid-range logic integration for control, glue-logic, and custom processing tasks.
• On-chip memory  Total embedded RAM of 25,088 bits for local buffering, state storage, and small data tables.
• I/O density  205 available I/O pins to support multiple peripherals, buses, and external interfaces.
• Power supply  Operates from a 3.0 V to 3.6 V supply, compatible with common system power rails.
• Package and mounting  Surface-mount 256‑BBGA package; supplier device package listed as 256‑PBGA (27×27) for board-level planning.
• Industrial temperature rating  Rated for operation from −40 °C to 100 °C and specified as Industrial grade for deployment in temperature-challenging environments.
• RoHS compliant  Meets RoHS requirements for restricted hazardous substances.

Typical Applications

• Industrial control and automation  Leverages the industrial temperature range and 205 I/O pins for sensor interfacing, control logic, and field I/O aggregation.
• Embedded system integration  Provides configurable logic and on‑chip RAM for custom glue logic, protocol handling, and small buffering tasks in embedded platforms.
• Communications and interfacing  Offers the I/O density and programmable resources needed to implement protocol converters, interface bridges, and custom I/O staging.

Unique Advantages

• Balanced logic and memory  Combines roughly 1,862 logic elements with 25,088 bits of RAM to implement mid‑complexity functions without external memory in many cases.
• High I/O count  205 I/O pins reduce the need for external I/O expanders and simplify board-level integration for multi‑interface designs.
• Industrial suitability  Operation from −40 °C to 100 °C and Industrial grade classification support deployment in temperature-varied environments.
• Compact BGA footprint  256‑BBGA (256‑PBGA, 27×27) package delivers dense integration for space-constrained PCBs while enabling surface-mount assembly.
• RoHS compliance  Designs can meet environmental compliance goals with this RoHS‑compliant device.

Why Choose XC4020XL-3BG256I?

The XC4020XL-3BG256I positions itself as a mid-range FPGA solution that combines configurable logic resources, modest on‑chip memory, and a high I/O count within a compact BGA package. Its voltage and temperature specifications make it suitable for industrial embedded designs that require reliable, reconfigurable logic close to the system I/O.

This device is well suited for engineers and procurement teams building industrial controllers, interface concentrators, and embedded prototypes that benefit from on‑chip logic and memory integration, robust thermal range, and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the XC4020XL-3BG256I.