XC4020XL-3HT144I

The XC4020XL-3HT144I is a Field Programmable Gate Array (FPGA) IC from AMD provided in a 144-LQFP exposed pad package. It integrates 1,862 logic elements, approximately 25,088 bits of on-chip RAM and supports up to 113 I/O pins, making it suitable for designs that require moderate programmable logic density and flexible I/O.

Designed for surface-mount assembly and rated for industrial operating temperatures from -40 °C to 100 °C with a 3.0–3.6 V supply range, this device targets applications where reliable operation over a wide temperature range and a compact, exposed-pad package are important.

Key Features

• Core Logic — 1,862 logic elements provide programmable logic resources for implementing custom digital functions.
• Embedded Memory — Approximately 25,088 bits of on-chip RAM to support state storage, FIFOs or small data buffers within the FPGA fabric.
• I/O Capacity — Up to 113 I/O pins to interface with peripherals, buses and external devices.
• Gate Count — 20,000 gates for overall design capacity and partitioning between logic and routing.
• Package — 144-LQFP exposed pad (supplier device package: 144-TQFP 20×20) suitable for surface-mount PCB assembly and thermal dissipation through the exposed pad.
• Power — Operates from a 3.0 V to 3.6 V supply range, enabling straightforward integration with 3.3 V system rails.
• Temperature Range — Industrial-grade operation from -40 °C to 100 °C for deployments in demanding environments.
• Mounting & Compliance — Surface-mount device with RoHS compliance for lead-free assembly processes.

Typical Applications

• Industrial Control — Implement control logic and finite-state machines that require stable operation across -40 °C to 100 °C and multiple I/O connections.
• I/O Bridging and Glue Logic — Use available 113 I/O pins and 1,862 logic elements to implement protocol translation, bus interfacing or glue logic between system components.
• Embedded System Prototyping — Prototype custom digital functions with on-chip RAM and a compact surface-mount package for rapid evaluation and board-level testing.

Unique Advantages

• Balanced Logic and Memory: 1,862 logic elements combined with 25,088 bits of RAM let you implement control logic and small data buffering without external memory in many designs.
• Generous I/O Count: 113 I/O pins provide flexible connectivity for sensors, peripherals and interfaces, reducing the need for external I/O expanders.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for deployment in temperature-sensitive or industrial environments.
• Compact, Thermally Aware Package: 144-LQFP with an exposed pad supports surface-mount assembly while offering improved thermal path to the PCB.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for environmentally conscious production.

Why Choose XC4020XL-3HT144I?

The XC4020XL-3HT144I delivers a practical combination of programmable logic density, on-chip RAM and substantial I/O in a compact 144-LQFP exposed pad package. Its 3.0–3.6 V operation, industrial temperature rating and surface-mount form factor make it well suited to embedded and industrial designs that require reliable, compact programmable logic.

For engineers and procurement teams seeking a mid-density FPGA solution from AMD with clear electrical and environmental specifications, the XC4020XL-3HT144I offers predictable integration into existing 3.3 V systems and assemblies while supporting RoHS-compliant manufacturing.

Request a quote or submit an inquiry to check availability and get pricing information for the XC4020XL-3HT144I.