XC4025E-2HQ304C
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 256 32768 2432 304-BFQFP Exposed Pad |
|---|---|
| Quantity | 610 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 304-PQFP (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 304-BFQFP Exposed Pad | Number of I/O | 256 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1024 | Number of Logic Elements/Cells | 2432 | ||
| Number of Gates | 25000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32768 |
Overview of XC4025E-2HQ304C – XC4000E/X Field Programmable Gate Array (FPGA) IC
The XC4025E-2HQ304C is a commercial-grade Field Programmable Gate Array (FPGA) from AMD’s XC4000E/X family. It provides on-chip programmable logic, embedded RAM, and a high I/O count in a surface-mount 304-BFQFP exposed-pad package, targeting designs that require flexible digital logic implementation and substantial I/O connectivity.
With 2,432 logic elements, approximately 32 Kbits of embedded memory and 256 I/O pins, this device is suited for applications that need moderate logic capacity, local RAM for buffering or state storage, and a 5 V supply operating environment.
Key Features
- Programmable Logic Capacity — 2,432 logic elements provide a balance of combinational and sequential resources for custom digital functions and glue-logic integration.
- Embedded Memory — Approximately 32 Kbits (32,768 bits) of on-chip RAM support local buffering, small data tables, and state storage for control logic.
- High I/O Count — 256 user I/O pins enable wide parallel interfaces, extensive peripheral connectivity, and multi-channel designs.
- Gate Equivalency — Rated at 25,000 gates, suitable for moderate-complexity RTL implementations and system glue logic.
- Power and Voltage — Operates from a 4.75 V to 5.25 V supply, matching legacy 5 V system rails.
- Package and Mounting — 304-BFQFP exposed-pad (supplier package: 304-PQFP 40 × 40) in a surface-mount form factor for compact board layouts and thermal conduction via the exposed pad.
- Operating Range — Commercial temperature range of 0 °C to 85 °C for typical electronics and embedded applications.
- Compliance — RoHS compliant, simplifying use in assemblies with lead-free requirements.
Typical Applications
- Digital system prototyping — Use the FPGA’s 2,432 logic elements and on-chip RAM to iterate and validate custom logic, interfaces, and control functions before final ASIC or MCU migration.
- Parallel interface bridging — 256 I/O pins enable implementation of wide data buses, protocol translators, or parallel-to-serial aggregation in communication and control subsystems.
- Embedded control and glue logic — The device’s gate and logic-element capacity suits integration of peripheral controllers, timing logic, and custom state machines to reduce discrete components.
- Local buffering and small-data storage — Approximately 32 Kbits of embedded RAM support FIFOs, lookup tables, and small buffering tasks close to logic elements to improve system responsiveness.
Unique Advantages
- Balanced logic density: 2,432 logic elements and 25,000 gate equivalence provide sufficient capacity for moderate-complexity designs without excessive device over-specification.
- High I/O integration: 256 available I/O pins reduce the need for external I/O expanders and simplify board-level routing for multi-signal systems.
- On-board memory capability: Approximately 32 Kbits of embedded RAM enables local data storage and buffering that can improve timing and reduce external memory dependency.
- Standard 5 V supply compatibility: Operates from 4.75 V to 5.25 V, facilitating integration into existing 5 V systems and legacy boards.
- Compact surface-mount package with thermal pad: 304-BFQFP exposed-pad package supports dense PCB layouts and offers a thermal path for heat dissipation.
- RoHS compliance: Meets lead-free assembly requirements for modern manufacturing processes.
Why Choose XC4025E-2HQ304C?
The XC4025E-2HQ304C positions itself as a practical, commercially graded FPGA solution for designs that require a mid-range mix of logic, memory, and extensive I/O in a compact surface-mount package. Its combination of 2,432 logic elements, approximately 32 Kbits of embedded RAM and 256 I/O pins makes it suitable for teams needing programmable hardware to implement custom digital functions, interface bridging, and embedded control without moving to larger, more costly devices.
For engineering and procurement teams, the device offers scalable functionality for prototype-to-production flows where commercial-grade temperature range and RoHS compliance meet standard industrial assembly requirements.
Request a quote or submit an inquiry to check availability and pricing for the XC4025E-2HQ304C and to obtain support for volume requirements or specific lead-time questions.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








