XC4025E-3HQ240C

The XC4025E-3HQ240C is a field programmable gate array (FPGA) from the XC4000E/X family, supplied in a 240‑pin BFQFP package with an exposed pad. It provides mid-range programmable logic resources with on-chip RAM and a high I/O count for board-level integration in commercial electronic designs.

With 2,432 logic elements, 32,768 bits of embedded RAM and 193 user I/O, the device is intended for mid-density logic implementations where a combination of logic capacity and I/O connectivity is required. The device operates from a 4.75 V to 5.25 V supply and is rated for commercial temperature ranges (0 °C to 85 °C).

Key Features

• Core Logic 2,432 logic elements provide mid-density programmable logic capacity suitable for glue logic, custom state machines and moderate combinational/sequential logic integration.
• Embedded Memory 32,768 bits of on-chip RAM (approximately 0.033 Mbits) for small data buffering, FIFOs or lookup tables directly on the device.
• I/O and Connectivity 193 user I/O pins allow for extensive peripheral and bus interfacing on a single device, reducing the need for external glue logic.
• Package and Mounting 240‑BFQFP with exposed pad (supplier device package: 240‑PQFP 32×32) in a surface mount format for easy PCB assembly and robust board-level mounting.
• Power and Temperature Single supply operation from 4.75 V to 5.25 V and a commercial operating temperature range of 0 °C to 85 °C.
• Compliance RoHS‑compliant construction for lead‑free manufacturing and regulatory alignment.

Typical Applications

• Embedded Control and Glue Logic Mid-density programmable logic capacity and plentiful I/O make the device suitable for implementing control logic, protocol translation, and board-level glue functions.
• I/O-Intensive Interfaces With 193 I/O pins, the FPGA supports designs that require multiple peripherals, parallel buses or broad external device connectivity.
• On-Device Data Staging The 32,768 bits of embedded RAM are useful for small buffering, FIFO implementation or lookup-table storage within embedded systems.

Unique Advantages

• Balanced Logic and I/O Density: 2,432 logic elements paired with 193 I/O pins enable integration of logic and interface functions on a single device, reducing external components.
• Compact, Board‑Ready Packaging: The 240‑BFQFP exposed pad package in a surface mount format simplifies PCB assembly and accommodates dense board layouts.
• On‑Chip Memory Availability: 32,768 bits of embedded RAM provide local storage for buffering and control tasks without immediate need for external memory.
• Standard 5 V Supply: Operation from a 4.75 V to 5.25 V supply aligns with common legacy and commercial power rails.
• RoHS‑Compliant: Lead‑free, RoHS‑compliant construction supports modern manufacturing and regulatory requirements.

Why Choose XC4025E-3HQ240C?

The XC4025E-3HQ240C offers a pragmatic mix of logic capacity, embedded RAM and high I/O count in a compact surface-mount package, making it well suited to commercial designs that require mid-density programmable logic and flexible interfacing. Its 240‑pin BFQFP footprint and exposed pad support practical board‑level integration while the device’s supply and temperature ratings match common commercial deployments.

This part is aimed at designers and procurement teams seeking a commercially graded FPGA with clear, verifiable specifications for logic resources, memory and I/O. It provides a straightforward option for consolidating logic and interface functions onto a single device while maintaining RoHS compliance.

If you would like pricing or availability for the XC4025E-3HQ240C, request a quote or submit a pricing inquiry to receive further details and lead‑time information.