XC4025E-4HQ240C

IC FPGA 193 I/O 240QFP
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 193 32768 2432 240-BFQFP Exposed Pad

Quantity 1,257 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O193Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1024Number of Logic Elements/Cells2432
Number of Gates25000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of XC4025E-4HQ240C – XC4000E/X FPGA, 2,432 logic elements, 32,768-bit RAM, 193 I/O

The XC4025E-4HQ240C from AMD is a commercial-grade Field Programmable Gate Array (FPGA) IC in the XC4000E/X family. It combines a configurable logic fabric with on-chip RAM and a high I/O count to support midsize custom logic implementations in surface-mount designs.

This device targets applications that require up to 2,432 logic elements, 32,768 bits of embedded RAM and 193 user I/O pins, while operating from a 4.75 V to 5.25 V supply and within a 0 °C to 85 °C commercial temperature range.

Key Features

  • Core logic capacity — 1024 CLBs and 2,432 logic elements provide programmable fabric for custom digital logic, supporting approximately 25,000 gates for midsize designs.
  • On-chip memory — 32,768 bits of embedded RAM available for buffering, state storage, and small data tables within the FPGA fabric.
  • I/O density — 193 user I/O pins to support multiple peripheral connections and board-level interfaces.
  • Package and mounting — 240-BFQFP with exposed pad (supplier device package: 240-PQFP, 32×32) in a surface-mount form factor for reliable PCB integration.
  • Power supply — Single-supply operation from 4.75 V to 5.25 V.
  • Operating range — Commercial grade operation from 0 °C to 85 °C.
  • Regulatory — RoHS compliant.

Typical Applications

  • Commercial embedded systems — Use the device where midsize programmable logic and moderate I/O count are required in commercial-temperature products.
  • Custom glue logic and system integration — Implement interface bridging, protocol translation, and board-level logic using the available CLBs and logic elements.
  • I/O-rich designs — Leverage 193 user I/O pins for designs that require multiple parallel signals or mixed peripheral connectivity.

Unique Advantages

  • Balanced logic and memory — 2,432 logic elements paired with 32,768 bits of RAM support a wide range of midsize logic functions without external memory.
  • High I/O capacity — 193 I/O pins reduce the need for additional I/O expanders in pin-demanding designs.
  • Surface-mount BFQFP package with exposed pad — Facilitates thermal performance and assembly in standard SMT production flows.
  • Commercial temperature grading — Rated for 0 °C to 85 °C, suitable for typical commercial electronic products.
  • RoHS compliant — Meets common lead-free manufacturing and environmental requirements.

Why Choose XC4025E-4HQ240C?

The XC4025E-4HQ240C delivers a practical combination of programmable logic capacity, embedded RAM, and extensive I/O in a commercial-grade, surface-mount package. It is well suited for designers needing midsize FPGA capability—enabling board-level integration of custom digital functions while minimizing external components.

Its specified supply range, package options, and RoHS compliance make it a reliable choice for commercial embedded projects where predictable operating conditions and assembly compatibility are important.

Request a quote or submit a procurement inquiry for the XC4025E-4HQ240C to receive pricing and availability information for your next design.

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