XC4028XL-2BG256I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 205 32768 2432 256-BBGA |
|---|---|
| Quantity | 857 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BBGA | Number of I/O | 205 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1024 | Number of Logic Elements/Cells | 2432 | ||
| Number of Gates | 28000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32768 |
Overview of XC4028XL-2BG256I – XC4000E/X FPGA, 2432 Logic Elements, 256-BBGA
The XC4028XL-2BG256I is a Field Programmable Gate Array (FPGA) IC from AMD’s XC4000E/X family, offering reprogrammable logic with on-chip memory and a high I/O count. It targets designs that require moderate logic density, embedded RAM for buffering, and a robust industrial operating range.
Key attributes include 2,432 logic elements, 32,768 bits of on-chip RAM, 205 I/O pins, and a 256-ball BBGA package, providing a balanced combination of integration, I/O capability, and temperature-rated reliability.
Key Features
- Logic Capacity Approximately 2,432 logic elements and 1,024 configurable logic blocks provide the core resources for implementing custom logic and control functions.
- Embedded Memory 32,768 bits of on-chip RAM support local buffering, small FIFOs, and data storage for state machines and control logic.
- I/O Count 205 available I/O pins enable dense interfacing with peripherals, sensors, and external devices.
- Gate Equivalent Listed at 28,000 gates to characterize overall device complexity for design planning.
- Power Operates from a 3 V to 3.6 V supply range to match common system voltage rails.
- Package & Mounting 256-ball BBGA package; supplier device package noted as 256-PBGA (27×27). Surface-mount mounting type supports standard PCB assembly processes.
- Temperature & Grade Industrial-grade device specified for operation from −40 °C to 100 °C for use in temperature-challenging environments.
- Environmental Compliance RoHS compliant for regulatory and supply-chain considerations.
Typical Applications
- Industrial Control Implement control logic, state machines, and interface bridging in industrial automation systems that require industrial temperature operation.
- Embedded Prototyping Use as a reprogrammable platform for prototyping custom logic and ASIC emulation with moderate logic density and on-chip RAM.
- Communications Interface Aggregate and translate signals between buses and peripherals using the device’s substantial I/O count and configurable logic.
- Sensor and Data Aggregation Handle sensor interfacing, simple data buffering, and preprocessing tasks using the embedded RAM and multiple I/O lines.
Unique Advantages
- Balanced logic and memory Combines 2,432 logic elements with 32,768 bits of on-chip RAM for mixed logic and buffering requirements without external memory for small data sets.
- High I/O density 205 I/O pins support multiple peripheral connections and complex interface requirements, reducing the need for external I/O expanders.
- Industrial temperature range Specified −40 °C to 100 °C operation enables deployment in thermally demanding environments.
- Standard surface-mount packaging 256-BBGA/256-PBGA (27×27) package supports compact PCB designs and industry-standard assembly processes.
- Simple power requirements 3 V to 3.6 V supply range eases integration into common system power rails.
- Regulatory-friendly RoHS compliance simplifies sourcing and environmental compliance for product builds.
Why Choose XC4028XL-2BG256I?
The XC4028XL-2BG256I delivers a practical mix of logic capacity, embedded memory, and I/O density for mid-range FPGA applications where industrial temperature operation and compact packaging matter. Its specification set makes it suitable for engineers designing industrial control, interface bridging, and embedded prototyping solutions that require reprogrammable logic with on-chip RAM and extensive I/O.
This device offers predictable electrical and thermal characteristics—3 V to 3.6 V supply range and −40 °C to 100 °C operation—alongside RoHS compliance, supporting reliable long-term integration into production designs and supply chains.
Request a quote or submit an inquiry to receive pricing and availability for the XC4028XL-2BG256I and to discuss how it fits your design requirements.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








