XC4028XL-2BG352I

IC FPGA 256 I/O 352MBGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 256 32768 2432 352-LBGA Exposed Pad, Metal

Quantity 422 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package352-MBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case352-LBGA Exposed Pad, MetalNumber of I/O256Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1024Number of Logic Elements/Cells2432
Number of Gates28000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of XC4028XL-2BG352I – XC4000E/X Field Programmable Gate Array (FPGA) IC 256 32768 2432 352-LBGA Exposed Pad, Metal

The XC4028XL-2BG352I is a field programmable gate array (FPGA) IC from AMD in the XC4000E/X family. It provides on-chip programmable logic and connectivity in a 352-LBGA exposed pad package suited for surface-mount applications.

This FPGA combines a defined logic fabric, embedded memory and a high I/O count to address programmable digital logic and interfacing needs in industrial-grade environments operating from -40 °C to 100 °C.

Key Features

  • Logic Capacity  1024 logic blocks and 2,432 logic elements (cells) enable implementation of custom digital logic functions and control state machines.
  • Embedded Memory  Approximately 32 kbits of on-chip RAM provide local storage for buffering, small FIFOs and state retention.
  • I/O Density  256 user I/O pins support extensive external interfacing for peripheral control, parallel buses and signal routing.
  • Gate Count  Approximately 28,000 gates, giving a clear reference for design partitioning and resource planning.
  • Power and Supply  Operates from a 3.0 V to 3.6 V supply window to match standard digital system rails.
  • Package and Mounting  352-LBGA exposed pad, metal package (supplier package: 352-MBGA, 35×35) for surface-mount assembly and thermal management.
  • Industrial Temperature Rating  Specified for -40 °C to 100 °C operation, supporting deployment in industrial environments.
  • RoHS Compliance  Meets RoHS environmental requirements for lead-free manufacturing and assembly.

Typical Applications

  • Custom digital logic and prototyping  Use the XC4028XL-2BG352I to implement bespoke state machines, glue logic and proof-of-concept digital designs where reconfigurable logic is required.
  • I/O-heavy interfacing  With 256 I/O pins, the device is suitable for parallel bus bridging, peripheral aggregation and signal routing between subsystems.
  • Embedded control and finite-state systems  The combination of logic elements and approximately 32 kbits of on-chip RAM supports control algorithms, small data buffering and local decision-making in industrial equipment.

Unique Advantages

  • Balanced logic and I/O capacity: 2,432 logic elements combined with 256 I/O pins let you implement both mid-complexity logic and extensive external interfaces without immediate need for external glue components.
  • On-chip embedded memory: Approximately 32 kbits of RAM enable local buffering and small data storage close to your logic, reducing external memory dependency for many control tasks.
  • Industrial temperature range: Rated from -40 °C to 100 °C for reliable operation in industrial environments and harsher operating conditions.
  • Standard 3.0–3.6 V supply: Compatibility with common digital supply rails simplifies power-supply design and integration into existing systems.
  • Compact, thermally aware package: 352-LBGA exposed pad, metal package supports surface-mount assembly while providing a thermal path for heat dissipation in dense board layouts.
  • RoHS-compliant: Meets lead-free manufacturing requirements for modern production processes.

Why Choose XC4028XL-2BG352I?

The XC4028XL-2BG352I positions itself as a practical mid-density FPGA solution combining a clear set of logic resources, embedded memory and a high I/O count in a compact 352-LBGA exposed-pad package. Its industrial temperature rating and RoHS compliance make it suitable for deployments where environmental tolerance and modern manufacturing requirements matter.

This device is well suited for engineers and teams implementing custom digital logic, I/O-rich interfaces, and embedded control functions who require predictable resource counts (1024 logic blocks, 2,432 logic elements, ~32 kbits RAM, 256 I/Os) and a straightforward voltage and package specification for system integration.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the XC4028XL-2BG352I.

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