XC4VLX40-11FF1148I

IC FPGA 640 I/O 1148FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 640 1769472 41472 1148-BBGA, FCBGA

Quantity 1,380 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1148-FCPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1148-BBGA, FCBGANumber of I/O640Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4608Number of Logic Elements/Cells41472
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC4VLX40-11FF1148I – Virtex®-4 LX FPGA, 1148-BBGA FCBGA

The XC4VLX40-11FF1148I is a Virtex-4 LX field programmable gate array (FPGA) IC delivering mid-range logic capacity with high I/O density in a 1148-BBGA FCBGA package. It provides 41,472 logic elements, approximately 1.77 Mbits of embedded RAM, and 640 configurable I/O pins for designs that require balanced logic, memory, and interface resources.

Designed for industrial-grade operation, this device supports an operating temperature range of -40 °C to 100 °C and a supply voltage window of 1.14 V to 1.26 V, making it suitable for systems that require robust environmental tolerance and controlled core-voltage operation.

Key Features

  • Core Capacity — 41,472 logic elements and 4,608 CLBs provide substantial programmable logic resources for mid-range digital designs.
  • Embedded Memory — Approximately 1.77 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory.
  • I/O Density — 640 user I/O pins to handle multiple external interfaces and parallel connections directly on-chip.
  • Power and Voltage — Operates from 1.14 V to 1.26 V supply, enabling precise core-voltage planning in power-sensitive designs.
  • Package and Mounting — 1148-BBGA FCBGA package (supplier device package: 1148-FCPBGA (35x35)) in a surface-mount form factor for high-density PCB integration.
  • Temperature and Grade — Industrial grade with an operating range of -40 °C to 100 °C to meet demanding environmental requirements.
  • Compliance — RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

  • High-density I/O systems — With 640 I/O pins, the device supports designs that require many external interfaces or parallel data lanes.
  • Compute and control logic — 41,472 logic elements and 4,608 CLBs enable implementation of control, signal-processing, and custom logic blocks.
  • Embedded buffering and local memory — Approximately 1.77 Mbits of embedded RAM is available for data buffering, FIFOs, and local state storage.
  • Industrial equipment — Industrial-grade temperature rating (-40 °C to 100 °C) supports deployment in equipment exposed to wide temperature ranges.

Unique Advantages

  • Balanced logic and memory resources: A combination of 41,472 logic elements and ~1.77 Mbits of embedded RAM reduces reliance on external components for many mid-range designs.
  • High I/O count: 640 I/O pins simplify direct interfacing to sensors, peripherals, and parallel buses, minimizing the need for external expanders.
  • Industrial operating range: Rated from -40 °C to 100 °C to support applications requiring broader environmental tolerance.
  • Compact surface-mount package: 1148-BBGA FCBGA (1148-FCPBGA (35x35)) enables dense PCB layouts while maintaining robust connections.
  • Controlled core voltage: 1.14 V to 1.26 V supply range allows precise power planning for core subsystems.
  • RoHS compliant: Meets common environmental and manufacturing requirements for lead-free assembly.

Why Choose XC4VLX40-11FF1148I?

The XC4VLX40-11FF1148I positions itself as a reliable mid-range FPGA choice where substantial programmable logic, embedded memory, and a high count of I/O are required in a single device. Its industrial temperature rating and surface-mount 1148-BBGA package support robust hardware designs that must operate across a wide thermal range.

This device is suited to design teams needing a balanced mix of logic resources, on-chip RAM, and interface density while maintaining RoHS compliance and predictable core-voltage requirements. Its combination of features supports scalable, long-lived designs where integration and thermal robustness matter.

Request a quote or submit a request for pricing and availability to move your design forward with the XC4VLX40-11FF1148I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up