XC4VLX40-11FF668I

The XC4VLX40-11FF668I is a Virtex®-4 LX Field Programmable Gate Array (FPGA) supplied in a 668‑ball FCBGA package. It provides a combination of programmable logic, embedded memory, and a high I/O count tailored for industrial-grade designs.

Key device characteristics include 41,472 logic elements, approximately 1.77 Mbits of on-chip RAM, 448 I/O pins, an industrial operating range from −40 °C to 100 °C, and a core supply voltage range of 1.14 V to 1.26 V.

Key Features

• Core Logic  41,472 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 1.77 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Capacity  448 user I/O pins for wide connectivity to peripherals, buses, and external devices.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power rails and design requirements.
• Package & Mounting  668‑ball FCBGA (27 × 27 mm) package, surface-mount mounting for compact board-level integration.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C for reliable operation across demanding environments.
• Regulatory  RoHS compliant.

Unique Advantages

• High logic density: 41,472 logic elements enable implementation of sizable custom logic blocks without external ASICs.
• Substantial on-chip RAM: Approximately 1.77 Mbits of embedded memory supports buffering, packet storage, and data processing on-chip.
• Extensive I/O connectivity: 448 I/O pins provide flexibility for interfacing multiple peripherals and high-pin-count buses.
• Industrial temperature qualification: Rated from −40 °C to 100 °C to meet thermal requirements of industrial applications.
• Compact, robust packaging: 668‑ball FCBGA (27×27) offers a dense footprint for space-constrained PCB designs.
• Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with contemporary low-voltage system designs.

Why Choose XC4VLX40-11FF668I?

The XC4VLX40-11FF668I positions itself as a capable programmable-logic solution for designs that require a balance of logic capacity, embedded memory, and high I/O count within an industrial temperature envelope. Its combination of 41,472 logic elements and approximately 1.77 Mbits of on-chip RAM enables integration of complex functions and substantial data buffering on a single device.

This device is suited for engineers and procurement teams seeking a RoHS-compliant FPGA in a compact 668‑FCBGA package with broad I/O and an industrial operating range, offering design scalability and board-level integration flexibility.

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