XC4VLX40-11FFG668I

The XC4VLX40-11FFG668I is a Virtex®-4 LX field programmable gate array optimized for high-density logic integration in surface-mount, ball-grid package formats. It provides a large complement of logic resources, embedded memory, and I/O capability for demanding industrial applications requiring configurable digital logic and system-level integration.

Designed for industrial-grade deployment, this device delivers a balance of programmable logic, on-chip RAM, and broad I/O in a 668-ball FCBGA (27 × 27) package with RoHS compliance.

Key Features

• Logic Capacity — 41,472 logic elements to implement complex digital functions and state machines.
• Embedded Memory — Approximately 1.77 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Density — 448 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package and Mounting — 668-BBGA / 668-FCBGA (27 × 27) package, surface-mount compatible for PCB assembly.
• Power — Core supply voltage range from 1.14 V to 1.26 V to match system power rails and design requirements.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in industrial environments.
• Compliance — RoHS compliant for reduced hazardous materials in production.

Typical Applications

• High-density digital processing — Implement compute-intensive logic and custom datapaths using 41,472 logic elements and embedded RAM for intermediate storage.
• Parallel I/O systems — Integrate wide parallel interfaces and multiple peripherals using the device's 448 I/O pins.
• Industrial control and automation — Deploy configurable control logic within the −40 °C to 100 °C operating range for industrial environments.

Unique Advantages

• Substantial logic resources: 41,472 logic elements enable implementation of large-scale custom logic without external gate arrays.
• On-chip memory: Approximately 1.77 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• High I/O count: 448 I/O pins provide flexibility for parallel interfaces, bus bridging, and multi-channel connectivity.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in temperature-variable industrial settings.
• Compact packaging: 668-FCBGA (27 × 27) surface-mount package balances high pin count with a compact PCB footprint.
• RoHS compliant: Meets environmental requirements for reduced hazardous substances in manufacturing.

Why Choose XC4VLX40-11FFG668I?

The XC4VLX40-11FFG668I positions itself as a robust configurable solution for engineers who need a high count of logic elements, significant embedded RAM, and broad I/O in an industrial-rated FPGA package. Its combination of capacity and package density supports system designs that require on-chip integration of complex digital functions while maintaining a compact PCB footprint.

This device is well suited to design teams focused on scalable, reliable implementations that benefit from a high logic-to-I/O ratio and on-chip memory, offering straightforward integration into industrial hardware platforms.

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