XC4VLX40-12FF668C

IC FPGA 448 I/O 668FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 448 1769472 41472 668-BBGA, FCBGA

Quantity 1,042 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package668-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case668-BBGA, FCBGANumber of I/O448Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4608Number of Logic Elements/Cells41472
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC4VLX40-12FF668C – Virtex®-4 LX FPGA, 668-FCBGA

The XC4VLX40-12FF668C is a Virtex®-4 LX Field Programmable Gate Array (FPGA) IC designed for designs that require substantial logic capacity, on-chip memory, and high I/O density. It combines 41,472 logic elements with approximately 1.77 Mbits of embedded memory and 448 I/O pins in a 668-ball FCBGA package, offering a compact, high-density programmable logic solution for commercial-temperature applications.

Key Features

  • Core Logic  Approximately 41,472 logic elements provide significant combinational and sequential resource capacity for complex logic implementations.
  • Embedded Memory  Approximately 1.77 Mbits of on-chip RAM to support buffering, FIFOs, and intermediate data storage without external memory.
  • I/O Capacity  448 user I/O pins to accommodate wide parallel interfaces and multiple simultaneous connections to peripherals and external devices.
  • Package  668-ball FCBGA (27 × 27 mm) package for high-density board integration while maintaining a compact footprint.
  • Power  Core supply voltage range of 1.14 V to 1.26 V to match system power rail requirements.
  • Operating Range  Commercial-grade operation from 0 °C to 85 °C suitable for standard commercial applications.
  • Compliance  RoHS compliant, meeting common environmental requirements for lead-free assembly.

Typical Applications

  • High-density logic implementations  Use the large logic element count for complex digital functions, custom processing pipelines, and protocol engines.
  • Memory-intensive designs  Leverage approximately 1.77 Mbits of embedded RAM for data buffering, packet queues, or on-chip caches.
  • High I/O systems  Support wide parallel interfaces, data acquisition front-ends, and multi-channel connectivity with 448 I/O pins.
  • Board-level FPGA integration  Compact 668-FCBGA package enables integration into space-constrained PCBs where high density is required.

Unique Advantages

  • Substantial logic capacity: 41,472 logic elements deliver the resources needed for sizeable custom logic and multi-function designs.
  • On-chip memory availability: Approximately 1.77 Mbits of embedded RAM reduces reliance on external memory, simplifying board design.
  • Extensive I/O: 448 I/Os provide flexibility to connect numerous peripherals, sensors, and interfaces without extra bridging logic.
  • Compact package: The 668-ball FCBGA (27 × 27 mm) provides high integration density for space-sensitive applications.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation for a wide range of standard commercial deployments.
  • RoHS compliant: Conforms to lead-free manufacturing requirements for environmentally conscious assembly processes.

Why Choose XC4VLX40-12FF668C?

The XC4VLX40-12FF668C positions itself as a high-density, commercially graded FPGA option for designers who need a balance of logic resources, embedded memory, and extensive I/O in a compact FCBGA package. Its combination of approximately 41,472 logic elements, roughly 1.77 Mbits of on-chip RAM, and 448 I/Os makes it well suited for complex digital systems, memory-heavy functions, and board-level integrations where footprint and connectivity matter.

With a defined core voltage range and a commercial operating temperature window, this Virtex®-4 LX device offers predictable electrical and thermal parameters for mainstream electronic designs while meeting RoHS environmental requirements.

Request a quote or contact sales to discuss availability, lead times, and pricing for the XC4VLX40-12FF668C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up