XC5215-5BG225CO359

The XC5215-5BG225CO359 is an XC5200 family Field Programmable Gate Array (FPGA) offered in a 225-BEBGA package. It provides a compact, surface-mount programmable logic solution for commercial electronic designs that require moderate gate density and a high I/O count.

With 1,936 logic elements and 196 I/O pins, this device is targeted at applications needing flexible digital glue logic, interface aggregation, and custom peripheral control while operating from a 4.75 V to 5.25 V supply within a 0 °C to 85 °C ambient range.

Key Features

• Core Logic — 1,936 logic elements and 484 CLBs provide the programmable resources for implementing custom combinational and sequential logic.
• Gate Capacity — Approximately 23,000 gates to support medium-complexity logic functions and state machines.
• I/O Density — 196 general-purpose I/O pins enable broad peripheral interfacing and multiple bus connections on a single device.
• Memory — Total on-chip RAM: 0 bits (no embedded RAM present), suitable for designs that utilize external memory or minimal on-chip storage.
• Power — Single supply operation from 4.75 V to 5.25 V, compatible with standard 5 V digital systems.
• Package & Mounting — 225-BEBGA package (supplier package listed as 225-PBGA, 27 × 27) in a surface-mount form factor for compact board layouts.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for typical consumer and commercial environments.
• Compliance — RoHS compliant for environmental and manufacturing standards alignment.

Typical Applications

• Consumer Electronics — Implement custom control logic and peripheral interfaces in consumer devices requiring moderate gate counts and many I/O.
• Embedded Control — Replace multiple discrete glue-logic components in embedded controllers to consolidate routing and simplify board layouts.
• Interface Aggregation — Aggregate and adapt multiple digital interfaces using the device’s 196 I/O for bridging sensors, displays, and external peripherals.
• Prototyping and Development — Use as a flexible platform for validating custom logic functions and system-level integration in commercial projects.

Unique Advantages

• High I/O Count in a Compact Package: 196 I/O pins in a 225-BEBGA allows dense interfacing without a large board footprint.
• Moderate Logic Capacity: 1,936 logic elements and ~23,000 gates support medium-complexity designs while keeping BOM and board complexity low.
• 5 V System Compatibility: 4.75 V to 5.25 V supply range integrates smoothly into existing 5 V digital systems and legacy designs.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, matching common commercial electronics requirements.
• RoHS Compliant: Meets RoHS regulations for environmentally conscious manufacturing and assembly processes.

Why Choose XC5215-5BG225CO359?

The XC5215-5BG225CO359 delivers a balanced combination of logic resources and high I/O density in a compact BGA package suited for commercial electronic designs. Its 1,936 logic elements, 196 I/O pins, and ~23,000-gate capacity make it appropriate for consolidating glue logic, handling interface aggregation, and implementing custom control functions where on-chip RAM is not required.

This FPGA is well suited to designers and procurement teams seeking a surface-mount, RoHS-compliant programmable device that operates on a standard 5 V supply and within commercial temperature ranges. It provides a practical option for mid-complexity applications where package size, pin count, and compatibility with 5 V systems are priorities.

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