XC5215-5HQ208CO359

FPGA, 324 CLBS, 10000 GATES
Part Description

XC5200 Field Programmable Gate Array (FPGA) IC 164 1936 208-BFQFP Exposed Pad

Quantity 1,725 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFP Exposed PadNumber of I/O164Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs484Number of Logic Elements/Cells1936
Number of Gates23000ECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of XC5215-5HQ208CO359 – FPGA IC, 1,936 Logic Elements, 164 I/O, 208-BFQFP Exposed Pad

The AMD XC5215-5HQ208CO359 is a field programmable gate array (FPGA) from the XC5200 family designed for mid-density programmable logic applications. It provides 1,936 logic elements and approximately 23,000 gates in a 208-BFQFP exposed pad surface-mount package with 164 user I/O pins.

Engineered for commercial-temperature systems, this FPGA is suited to designers needing flexible hardware customization within a 4.75 V to 5.25 V supply environment, while meeting RoHS compliance requirements.

Key Features

  • Core Logic 1,936 logic elements delivering roughly 23,000 gates of programmable logic capacity for implementing combinational and sequential designs.
  • I/O and Integration 164 user I/O pins to connect parallel peripherals, buses, and external devices in I/O-dense designs.
  • On-chip Memory Total on-chip RAM bits: 0 — no embedded RAM included on this device.
  • Power Supply Single-supply operation across 4.75 V to 5.25 V for compatibility with 5 V logic systems.
  • Package and Mounting 208-BFQFP with exposed pad (supplier device package 208-PQFP, 28×28) in a surface-mount form factor for PCB integration.
  • Operating Conditions Commercial temperature range from 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Legacy 5 V Embedded Systems — Use the 5 V supply compatibility to implement glue logic, protocol translation, or interface bridging in existing 5 V platforms.
  • I/O-Intensive Control — Leverage 164 I/Os for motor controllers, sensor aggregation, or multi-channel I/O management.
  • Custom Logic and Sequencing — Implement finite state machines, custom control logic, and timing-critical glue functions using the device’s logic elements and gate capacity.
  • Prototyping and Small-Scale Production — Suitable for prototype boards and commercial production runs where medium-density programmable logic and a BFQFP package are appropriate.

Unique Advantages

  • Medium-density programmable capacity: 1,936 logic elements and ~23,000 gates provide a balanced resource set for mid-complexity designs without excessive overhead.
  • High I/O count: 164 user I/Os enable direct connection to multiple peripherals and buses, reducing the need for external I/O expanders.
  • 5 V system compatibility: Operates from 4.75 V to 5.25 V, simplifying integration into existing 5 V designs and legacy equipment.
  • BFQFP exposed pad package: 208-pin surface-mount format (208-PQFP, 28×28) offers a compact footprint with an exposed pad for board-level mounting considerations.
  • Commercial-grade and RoHS compliant: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial applications.

Why Choose XC5215-5HQ208CO359?

The XC5215-5HQ208CO359 positions itself as a practical FPGA choice for designers requiring medium-density programmable logic with extensive I/O in a standard surface-mount BFQFP package. Its 1,936 logic elements and 164 I/Os are well matched to control, interfacing, and glue-logic tasks in commercial-temperature environments.

This device is appropriate for engineers and procurement teams targeting reliable, RoHS-compliant programmable solutions that operate from a 5 V supply and fit into established PCB form factors. It delivers a straightforward, verifiable set of capabilities for projects where embedded RAM is not required but flexible logic and high I/O count are essential.

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