XC7A15T-2CPG236C

IC FPGA 106 I/O 238CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 106 921600 16640 238-LFBGA, CSPBGA

Quantity 791 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package238-CSBGA (10x10)GradeCommercialOperating Temperature0°C – 85°C
Package / Case238-LFBGA, CSPBGANumber of I/O106Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1300Number of Logic Elements/Cells16640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits921600

Overview of XC7A15T-2CPG236C – Artix-7 FPGA, 238-LFBGA (238-CSBGA 10×10)

The XC7A15T-2CPG236C is an Artix-7 Field Programmable Gate Array (FPGA) IC delivering a balanced combination of logic capacity, embedded memory, and I/O for commercial-grade, surface-mount applications. It is suited for designs that require configurable logic, on-chip RAM, and a moderate I/O count within a compact 238-ball BGA package.

Key Features

  • Artix-7 FPGA core — Implements the Artix-7 FPGA architecture for configurable logic integration.
  • Logic capacity — Contains 16,640 logic elements to support a wide range of custom logic functions and glue-logic tasks.
  • Configurable logic blocks (CLBs) — Approximately 1,300 CLBs provide the structural resources for implementing synchronous and combinational logic.
  • Embedded memory — Approximately 0.92 Mbits of on-chip RAM for buffering, FIFOs, and small data storage needs.
  • I/O resources — 106 user I/O pins to interface with external peripherals, sensors, and buses.
  • Low-voltage core supply — Core voltage range from 0.95 V to 1.05 V to match typical Artix-7 power domains.
  • Package and mounting — 238-LFBGA / CSPBGA package, supplied as 238-CSBGA (10×10), designed for surface-mount assembly.
  • Operating range and grade — Commercial temperature range of 0 °C to 85 °C.
  • Environmental compliance — RoHS-compliant component suitable for environmentally regulated assemblies.

Typical Applications

  • Commercial embedded systems — Implements custom control and interface logic in space-constrained, surface-mount designs within commercial temperature limits.
  • Prototyping and development boards — Provides reprogrammable logic and on-chip RAM for proof-of-concept designs and iterative development.
  • I/O expansion and bridging — Uses 106 I/O pins to handle peripheral interfacing, protocol bridging, and signal aggregation tasks.
  • Digital signal control — Leverages 16,640 logic elements and embedded RAM for moderate-density signal processing pipelines and buffering.

Unique Advantages

  • Right-sized logic capacity: 16,640 logic elements offer substantial programmable resources without excessive area or cost for medium-complexity designs.
  • Meaningful on-chip RAM: Approximately 0.92 Mbits of embedded memory reduces external memory dependence for many buffering and temporary storage needs.
  • Ample I/O in a compact package: 106 user I/Os in a 238-ball BGA footprint enable multi-channel interfacing while keeping PCB real estate compact.
  • Low-voltage core operation: Support for 0.95–1.05 V core supply aligns with modern FPGA power domains and can help optimize overall board power design.
  • Surface-mount BGA packaging: 238-LFBGA / 238-CSBGA (10×10) package supports high-density, automated assembly for volume production.
  • RoHS compliant: Meets common environmental compliance requirements for commercial electronics manufacturing.

Why Choose XC7A15T-2CPG236C?

The XC7A15T-2CPG236C positions itself as a compact, commercially graded Artix-7 FPGA that balances logic density, embedded memory, and I/O in a surface-mount BGA package. Its combination of approximately 16,640 logic elements, ~0.92 Mbits of on-chip RAM, and 106 I/Os makes it suitable for developers and procurement teams targeting reprogrammable logic for commercial embedded applications and board-level integration.

This device is appropriate for designs that require reconfigurable logic capacity with a moderate memory footprint and significant I/O capability, all within a commercial temperature range and a 238-ball BGA package. The part's specifications support scalable implementations where on-chip resources and a compact package are key considerations.

Request a quote or submit a purchase inquiry to check availability and pricing for the XC7A15T-2CPG236C. Our team can assist with lead times and ordering for your production or development needs.

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