XC7A15T-2CPG236C
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 106 921600 16640 238-LFBGA, CSPBGA |
|---|---|
| Quantity | 791 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 238-CSBGA (10x10) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 238-LFBGA, CSPBGA | Number of I/O | 106 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1300 | Number of Logic Elements/Cells | 16640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 921600 |
Overview of XC7A15T-2CPG236C – Artix-7 FPGA, 238-LFBGA (238-CSBGA 10×10)
The XC7A15T-2CPG236C is an Artix-7 Field Programmable Gate Array (FPGA) IC delivering a balanced combination of logic capacity, embedded memory, and I/O for commercial-grade, surface-mount applications. It is suited for designs that require configurable logic, on-chip RAM, and a moderate I/O count within a compact 238-ball BGA package.
Key Features
- Artix-7 FPGA core — Implements the Artix-7 FPGA architecture for configurable logic integration.
- Logic capacity — Contains 16,640 logic elements to support a wide range of custom logic functions and glue-logic tasks.
- Configurable logic blocks (CLBs) — Approximately 1,300 CLBs provide the structural resources for implementing synchronous and combinational logic.
- Embedded memory — Approximately 0.92 Mbits of on-chip RAM for buffering, FIFOs, and small data storage needs.
- I/O resources — 106 user I/O pins to interface with external peripherals, sensors, and buses.
- Low-voltage core supply — Core voltage range from 0.95 V to 1.05 V to match typical Artix-7 power domains.
- Package and mounting — 238-LFBGA / CSPBGA package, supplied as 238-CSBGA (10×10), designed for surface-mount assembly.
- Operating range and grade — Commercial temperature range of 0 °C to 85 °C.
- Environmental compliance — RoHS-compliant component suitable for environmentally regulated assemblies.
Typical Applications
- Commercial embedded systems — Implements custom control and interface logic in space-constrained, surface-mount designs within commercial temperature limits.
- Prototyping and development boards — Provides reprogrammable logic and on-chip RAM for proof-of-concept designs and iterative development.
- I/O expansion and bridging — Uses 106 I/O pins to handle peripheral interfacing, protocol bridging, and signal aggregation tasks.
- Digital signal control — Leverages 16,640 logic elements and embedded RAM for moderate-density signal processing pipelines and buffering.
Unique Advantages
- Right-sized logic capacity: 16,640 logic elements offer substantial programmable resources without excessive area or cost for medium-complexity designs.
- Meaningful on-chip RAM: Approximately 0.92 Mbits of embedded memory reduces external memory dependence for many buffering and temporary storage needs.
- Ample I/O in a compact package: 106 user I/Os in a 238-ball BGA footprint enable multi-channel interfacing while keeping PCB real estate compact.
- Low-voltage core operation: Support for 0.95–1.05 V core supply aligns with modern FPGA power domains and can help optimize overall board power design.
- Surface-mount BGA packaging: 238-LFBGA / 238-CSBGA (10×10) package supports high-density, automated assembly for volume production.
- RoHS compliant: Meets common environmental compliance requirements for commercial electronics manufacturing.
Why Choose XC7A15T-2CPG236C?
The XC7A15T-2CPG236C positions itself as a compact, commercially graded Artix-7 FPGA that balances logic density, embedded memory, and I/O in a surface-mount BGA package. Its combination of approximately 16,640 logic elements, ~0.92 Mbits of on-chip RAM, and 106 I/Os makes it suitable for developers and procurement teams targeting reprogrammable logic for commercial embedded applications and board-level integration.
This device is appropriate for designs that require reconfigurable logic capacity with a moderate memory footprint and significant I/O capability, all within a commercial temperature range and a 238-ball BGA package. The part's specifications support scalable implementations where on-chip resources and a compact package are key considerations.
Request a quote or submit a purchase inquiry to check availability and pricing for the XC7A15T-2CPG236C. Our team can assist with lead times and ordering for your production or development needs.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








