XC7A25T-1CSG325I

IC FPGA 150 I/O 324CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 150 1658880 23360 324-LFBGA, CSPBGA

Quantity 432 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O150Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1825Number of Logic Elements/Cells23360
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1658880

Overview of XC7A25T-1CSG325I – Artix-7 Field Programmable Gate Array (FPGA) IC

The XC7A25T-1CSG325I is an Artix-7 Field Programmable Gate Array (FPGA) in a 324-pin LFBGA/CSPBGA package. It provides a balance of programmable logic capacity, on-chip memory, and I/O for designs that require flexible, reconfigurable digital logic.

Key on-chip resources include 23,360 logic elements and approximately 1.66 Mbits of embedded memory, along with 150 user I/O pins. The device is supplied in a 324-CSPBGA (15×15) surface-mount package and rated for industrial temperature operation from -40 °C to 100 °C.

Key Features

  • Programmable Logic Capacity  23,360 logic elements provide the core configurable resources for custom digital designs.
  • Embedded Memory  Approximately 1.66 Mbits of on-chip RAM for data buffering, lookup tables, and state storage.
  • I/O Count  150 user I/O pins to support a variety of digital interfaces and board-level connections.
  • Package & Mounting  324-LFBGA/CSPBGA package (supplier device package: 324-CSPBGA, 15×15) in a surface-mount form factor for compact board integration.
  • Supply Voltage  Core voltage specified at 950 mV to 1.05 V for system power planning and regulator selection.
  • Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C to meet industrial-environment thermal requirements.
  • Regulatory Compliance  RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

  • Custom Logic and Prototyping  Use the 23,360 logic elements and embedded memory to implement and iterate custom digital functions and prototypes.
  • Embedded System Control  Integrate control logic and data buffering with the device’s on-chip RAM and 150 I/O pins for embedded controllers.
  • High-density I/O Interfacing  Leverage 150 user I/Os in compact designs requiring numerous peripheral connections or protocol bridging.
  • Industrial Control and Monitoring  Industrial temperature rating and surface-mount packaging make the device suitable for industrial automation and monitoring electronics.

Unique Advantages

  • Balanced Logic and Memory: 23,360 logic elements paired with approximately 1.66 Mbits of RAM support a wide range of digital functions without external memory for many designs.
  • Flexible I/O: 150 user I/O pins enable dense peripheral connectivity and protocol interfacing on a single device.
  • Compact Surface-Mount Package: 324-CSPBGA (15×15) package allows high integration in space-constrained PCB layouts.
  • Industrial Temperature Range: Rated from -40 °C to 100 °C to address applications exposed to wide thermal variations.
  • Predictable Power Envelope: Core voltage range of 950 mV to 1.05 V helps with accurate power-supply design and thermal planning.
  • RoHS Compliant: Conforms to common environmental manufacturing standards for easier regulatory handling.

Why Choose XC7A25T-1CSG325I?

The XC7A25T-1CSG325I positions itself as a practical Artix-7 FPGA option where a combination of moderate logic density, embedded memory, and substantial I/O is required in a compact, surface-mount form factor. Its industrial temperature rating and RoHS compliance make it suitable for production systems that require environmental robustness and regulatory alignment.

This device is well suited for engineers and procurement teams designing embedded control, interfacing, or prototyping platforms that benefit from on-chip resources and predictable power and thermal requirements. Its package and specification profile support scalable designs and long-term deployment in temperature-challenging environments.

Request a quote or submit a procurement inquiry to receive pricing and availability details for the XC7A25T-1CSG325I. Our sales team can assist with volume pricing, lead times, and ordering information.

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