XC7A25T-1CPG238I
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 112 1658880 23360 238-LFBGA, CSPBGA |
|---|---|
| Quantity | 292 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 238-CSBGA (10x10) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 238-LFBGA, CSPBGA | Number of I/O | 112 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1825 | Number of Logic Elements/Cells | 23360 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1658880 |
Overview of XC7A25T-1CPG238I – Artix‑7 FPGA, 112 I/O, approximately 1.66 Mbits RAM, 23,360 logic elements, 238‑LFBGA
The XC7A25T-1CPG238I is an Artix‑7 Field Programmable Gate Array (FPGA) IC from AMD designed for industrial-grade programmable logic applications. It combines a mid-range logic fabric with embedded memory and a 112 I/O count in a compact 238‑LFBGA package, offering a balance of integration and thermal robustness for embedded and industrial designs.
Key Features
- Core Logic 23,360 logic elements provide a mid-range programmable fabric for implementing custom digital logic and control functions.
- Configurable Logic Blocks (CLBs) 1,825 CLBs for structured logic partitioning and resource allocation.
- Embedded Memory Approximately 1.66 Mbits of on‑chip RAM (1,658,880 bits) for buffering, FIFOs, and local data storage.
- I/O 112 user I/O pins to support a variety of external interfaces and peripheral connections.
- Power Core supply range of 0.95 V to 1.05 V to match low‑voltage system power domains.
- Package and Mounting 238‑LFBGA (238‑CSBGA, 10×10) surface‑mount package for high‑density board integration.
- Industrial Temperature Range Specified operating temperature from −40 °C to 100 °C for use in temperature‑challenging environments.
- Environmental Compliance RoHS‑compliant construction to meet common regulatory requirements for lead‑free assemblies.
Typical Applications
- Industrial Control — Implement custom control logic, I/O aggregation, and deterministic state machines within the −40 °C to 100 °C operating range.
- Embedded Systems — Use the mid‑range logic density and on‑chip RAM to build custom accelerators, protocol handlers, or glue logic for embedded platforms.
- Prototyping and Development — Leverage the combination of logic elements and I/O count for hardware validation and feature prototyping before scaling to production.
Unique Advantages
- Mid‑range programmable capacity: 23,360 logic elements enable substantial custom logic without moving to a larger device family.
- Sizable embedded memory: Approximately 1.66 Mbits of on‑chip RAM reduces dependency on external memory for many buffering and local storage needs.
- Flexible external connectivity: 112 I/O pins support diverse peripheral and interface requirements on a single device.
- Industrial robustness: Specified for −40 °C to 100 °C operation to support deployments in demanding ambient conditions.
- Compact board footprint: 238‑LFBGA surface‑mount package balances density and thermal performance for space‑constrained designs.
- Low‑voltage core: 0.95–1.05 V supply range aligns with modern low‑voltage power architectures.
Why Choose XC7A25T-1CPG238I?
The XC7A25T-1CPG238I positions itself as a practical choice for designs requiring mid‑range programmable logic, meaningful on‑chip memory, and a substantial I/O complement in an industrial‑rated package. Its combination of 23,360 logic elements, approximately 1.66 Mbits of embedded RAM, and a −40 °C to 100 °C operating range makes it suited to embedded and industrial control applications where integration and environmental resilience are important.
Specification-driven designs that need a balance between logic density, memory, and I/O count can use this Artix‑7 device to consolidate functions, reduce board-level component count, and maintain operation across a wide temperature window.
Request a quote or submit your requirements today to get pricing and availability for XC7A25T-1CPG238I.

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