XC7A200T-L2FFG1156E
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 500 13455360 215360 1156-BBGA, FCBGA |
|---|---|
| Quantity | 191 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 500 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 16825 | Number of Logic Elements/Cells | 215360 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13455360 |
Overview of XC7A200T-L2FFG1156E – Artix-7 Field Programmable Gate Array (FPGA) IC 1156-FCBGA (35x35)
The XC7A200T-L2FFG1156E is an Artix-7 Field Programmable Gate Array (FPGA) delivered in a 1156-ball FCBGA package. The device provides large programmable logic capacity, substantial on-chip memory, and a high I/O count to address designs that require extensive logic integration and flexible I/O connectivity.
With 215,360 logic elements, approximately 13.46 Mbits of embedded memory, and 500 I/O, this surface-mount FPGA is targeted at system designs that need high-density programmable resources within a compact FCBGA footprint while operating from a 0.95 V to 1.05 V core supply.
Key Features
- Artix-7 FPGA core Proven FPGA architecture branded as Artix-7 for programmable logic implementations.
- Logic capacity 215,360 logic elements provide substantial combinational and sequential resource for complex designs.
- Embedded memory Approximately 13.46 Mbits of on-chip RAM available for buffering, state storage, and local data processing.
- I/O and connectivity 500 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count system requirements.
- Power Core voltage supply range from 0.95 V to 1.05 V, enabling predictable integration into regulated power domains.
- Package and mounting 1156-FCBGA (35x35) package, surface-mount mounting type suitable for board-level FPGA installations.
- Operational range and grade Extended grade device rated for operation from 0 °C to 100 °C.
- Environmental compliance RoHS compliant.
Typical Applications
- Complex programmable logic implementations High logic capacity and on-chip memory enable large-scale state machines, custom accelerators, and glue logic consolidation.
- High I/O bridging and protocol interfacing 500 I/O pins support designs that require multiple parallel interfaces or dense board-level connectivity.
- Local data buffering and processing Approximately 13.46 Mbits of embedded RAM allow significant on-chip data storage for buffering, packet handling, or temporary data structures.
Unique Advantages
- Large programmable resource pool: 215,360 logic elements reduce the need for multiple devices by consolidating functions into a single FPGA.
- Significant on-chip memory: Approximately 13.46 Mbits of embedded RAM supports memory-intensive logic without immediate external memory dependence.
- High I/O density: 500 I/O pins give flexibility for interfacing to multiple peripherals, sensors, or parallel buses.
- Compact FCBGA package: 1156-ball FCBGA (35x35) offers a high-pin-count solution in a surface-mount form factor for space-constrained boards.
- Predictable power integration: Narrow core supply range (0.95 V–1.05 V) simplifies power rail planning for the FPGA core.
- Compliance-ready: RoHS compliance supports environmental and manufacturing requirements.
Why Choose XC7A200T-L2FFG1156E?
The XC7A200T-L2FFG1156E positions itself as a high-capacity, high-I/O Artix-7 FPGA well suited to designs that demand extensive programmable logic, substantial on-chip memory, and versatile board-level connectivity. Its extended grade and surface-mount 1156-FCBGA package provide a practical balance of integration density and manufacturability.
Choose this device when your design requires consolidation of large logic blocks, significant embedded memory, and a wide array of I/O within a single, RoHS-compliant FPGA package that operates from a defined core-voltage range and standard commercial-to-extended temperature window.
Request a quote or submit an inquiry to receive pricing and availability for the XC7A200T-L2FFG1156E and support for your design requirements.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








