XC7A200T-L2FFG1156E

IC FPGA 500 I/O 1156FCBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 500 13455360 215360 1156-BBGA, FCBGA

Quantity 191 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O500Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs16825Number of Logic Elements/Cells215360
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13455360

Overview of XC7A200T-L2FFG1156E – Artix-7 Field Programmable Gate Array (FPGA) IC 1156-FCBGA (35x35)

The XC7A200T-L2FFG1156E is an Artix-7 Field Programmable Gate Array (FPGA) delivered in a 1156-ball FCBGA package. The device provides large programmable logic capacity, substantial on-chip memory, and a high I/O count to address designs that require extensive logic integration and flexible I/O connectivity.

With 215,360 logic elements, approximately 13.46 Mbits of embedded memory, and 500 I/O, this surface-mount FPGA is targeted at system designs that need high-density programmable resources within a compact FCBGA footprint while operating from a 0.95 V to 1.05 V core supply.

Key Features

  • Artix-7 FPGA core  Proven FPGA architecture branded as Artix-7 for programmable logic implementations.
  • Logic capacity  215,360 logic elements provide substantial combinational and sequential resource for complex designs.
  • Embedded memory  Approximately 13.46 Mbits of on-chip RAM available for buffering, state storage, and local data processing.
  • I/O and connectivity  500 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count system requirements.
  • Power  Core voltage supply range from 0.95 V to 1.05 V, enabling predictable integration into regulated power domains.
  • Package and mounting  1156-FCBGA (35x35) package, surface-mount mounting type suitable for board-level FPGA installations.
  • Operational range and grade  Extended grade device rated for operation from 0 °C to 100 °C.
  • Environmental compliance  RoHS compliant.

Typical Applications

  • Complex programmable logic implementations  High logic capacity and on-chip memory enable large-scale state machines, custom accelerators, and glue logic consolidation.
  • High I/O bridging and protocol interfacing  500 I/O pins support designs that require multiple parallel interfaces or dense board-level connectivity.
  • Local data buffering and processing  Approximately 13.46 Mbits of embedded RAM allow significant on-chip data storage for buffering, packet handling, or temporary data structures.

Unique Advantages

  • Large programmable resource pool: 215,360 logic elements reduce the need for multiple devices by consolidating functions into a single FPGA.
  • Significant on-chip memory: Approximately 13.46 Mbits of embedded RAM supports memory-intensive logic without immediate external memory dependence.
  • High I/O density: 500 I/O pins give flexibility for interfacing to multiple peripherals, sensors, or parallel buses.
  • Compact FCBGA package: 1156-ball FCBGA (35x35) offers a high-pin-count solution in a surface-mount form factor for space-constrained boards.
  • Predictable power integration: Narrow core supply range (0.95 V–1.05 V) simplifies power rail planning for the FPGA core.
  • Compliance-ready: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC7A200T-L2FFG1156E?

The XC7A200T-L2FFG1156E positions itself as a high-capacity, high-I/O Artix-7 FPGA well suited to designs that demand extensive programmable logic, substantial on-chip memory, and versatile board-level connectivity. Its extended grade and surface-mount 1156-FCBGA package provide a practical balance of integration density and manufacturability.

Choose this device when your design requires consolidation of large logic blocks, significant embedded memory, and a wide array of I/O within a single, RoHS-compliant FPGA package that operates from a defined core-voltage range and standard commercial-to-extended temperature window.

Request a quote or submit an inquiry to receive pricing and availability for the XC7A200T-L2FFG1156E and support for your design requirements.

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