XC7A200T-L2FBG484E

The XC7A200T-L2FBG484E is an Artix-7 field programmable gate array (FPGA) from AMD designed for high-density programmable logic integration. With 215,360 logic elements and approximately 13.46 Mbits of embedded memory, this device targets applications that require substantial on-chip logic and memory resources within a compact FCBGA package.

Engineered for surface-mount assembly and extended-grade operation, the device offers a broad I/O count and a low-voltage core supply window, making it suitable for space-constrained designs that demand significant programmable logic capacity.

Key Features

• Logic Capacity  Provides 215,360 logic elements to implement complex custom digital functions and high-density logic architectures.
• Embedded Memory  Approximately 13.46 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density  285 I/O pins support extensive peripheral interfacing, GPIO expansion, and multi-channel signal routing.
• Power Supply  Core voltage supply range of 0.950 V to 1.050 V to match low-voltage system designs and regulator choices.
• Package & Mounting  484-FCBGA (23×23) package in a 484-BBGA/FCBGA case; intended for surface-mount board assembly.
• Operating Range  Rated for operation from 0 °C to 100 °C, suitable for extended-grade commercial environments.
• Compliance  RoHS compliant for environmental and regulatory alignment in lead-free assemblies.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded memory to implement custom accelerators, datapath pipelines, and complex state machines.
• Interface bridging and protocol aggregation  Leverage 285 I/Os to aggregate multiple peripherals and convert between protocols within a single package.
• Prototyping and system integration  Ideal for integrating multiple IP blocks and validating system architectures that require substantial programmable resources on a development or production board.

Unique Advantages

• High logic density: 215,360 logic elements accommodate complex designs and reduce the need for multiple devices.
• Significant on-chip memory: Approximately 13.46 Mbits of embedded RAM enables local buffering and state retention without external memory in many use cases.
• Extensive I/O capability: 285 I/Os simplify board-level routing and allow for numerous peripheral connections from a single FPGA.
• Compact FCBGA package: 484-FCBGA (23×23) offers a small board footprint for high-density system designs while supporting surface-mount assembly processes.
• Controlled power envelope: A defined core voltage range (0.950 V–1.050 V) helps with power-supply planning and regulator selection.
• RoHS compliant and extended grade: Meets lead-free environmental requirements and supports operation across a commercial extended temperature window.

Why Choose XC7A200T-L2FBG484E?

The XC7A200T-L2FBG484E positions itself as a high-capacity, programmable logic solution that combines a large logic element count and substantial embedded memory within a compact 484-FCBGA package. Its 285 I/Os and clearly defined supply and temperature ranges make it appropriate for designs that require extensive on-chip integration while adhering to surface-mount assembly workflows.

This device is suited for engineers and teams developing complex digital systems, interface aggregation solutions, and prototypes that benefit from a dense, RoHS-compliant FPGA offering from AMD. The combination of logic, memory, and I/O resources provides design scalability and integration value in space- and resource-constrained applications.

Request a quote or submit a purchase inquiry to get pricing and lead-time details for the XC7A200T-L2FBG484E.