XC7A200T-L1FBG676I

IC FPGA 400 I/O 676FCBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 400 13455360 215360 676-BBGA, FCBGA

Quantity 885 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O400Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs16825Number of Logic Elements/Cells215360
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13455360

Overview of XC7A200T-L1FBG676I – Artix-7 FPGA, 215,360 Logic Elements

The XC7A200T-L1FBG676I is an Artix-7 Field Programmable Gate Array (FPGA) IC featuring 215,360 logic elements and approximately 13.46 Mbits of embedded memory. Packaged in a 676-FCBGA (27×27) surface-mount package and offering up to 400 I/O, this device is specified for industrial operation and RoHS compliant.

Key Features

  • Core Logic 215,360 logic elements provide capacity for large-scale digital logic implementation.
  • Configurable Logic Blocks 16,825 CLBs to organize and map complex logic functions efficiently.
  • Embedded Memory Approximately 13.46 Mbits of on-chip RAM for buffering, state machines, and data storage.
  • I/O Density Up to 400 I/O pins to support a wide range of external interfaces and system integration.
  • Package and Mounting 676-BBGA / 676-FCBGA (27×27) surface-mount package for high-density board designs.
  • Power Core voltage supply specified from 0.950 V to 1.05 V to match system power rails.
  • Temperature and Grade Industrial grade operation from −40 °C to 100 °C for deployment in demanding environments.
  • Environmental Compliance RoHS compliant, supporting regulatory and manufacturing requirements.

Unique Advantages

  • High Logic Capacity: 215,360 logic elements enable substantial on-chip logic integration, reducing the need for external ASICs or multiple FPGAs.
  • Significant Embedded Memory: Approximately 13.46 Mbits of RAM supports larger buffers and more complex state retention without external memory.
  • Flexible I/O Count: 400 available I/O pins allow direct interfacing to multiple peripherals and high-density connectors.
  • Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in industrial and temperature-demanding applications.
  • Compact, High-Density Package: 676-FCBGA (27×27) surface-mount package offers a compact footprint for space-constrained PCBs while maintaining high pin count.
  • Standards-Friendly Compliance: RoHS compliance simplifies integration into modern manufacturing and regulatory workflows.

Why Choose XC7A200T-L1FBG676I?

The XC7A200T-L1FBG676I combines substantial logic and memory resources with a high pin count and an industrial temperature rating, making it well suited to designs that require integration, robustness, and on-chip capacity. Its 676-FCBGA package and defined supply voltage range support compact, power-aware system implementations.

This device is appropriate for engineers and purchasers seeking a programmable, high-capacity FPGA with on-chip memory and a broad I/O complement, backed by compliance for modern manufacturing processes.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the XC7A200T-L1FBG676I and accelerate your design planning.

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