XC7A200T-L1FBG676I
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 400 13455360 215360 676-BBGA, FCBGA |
|---|---|
| Quantity | 885 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 400 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 16825 | Number of Logic Elements/Cells | 215360 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13455360 |
Overview of XC7A200T-L1FBG676I – Artix-7 FPGA, 215,360 Logic Elements
The XC7A200T-L1FBG676I is an Artix-7 Field Programmable Gate Array (FPGA) IC featuring 215,360 logic elements and approximately 13.46 Mbits of embedded memory. Packaged in a 676-FCBGA (27×27) surface-mount package and offering up to 400 I/O, this device is specified for industrial operation and RoHS compliant.
Key Features
- Core Logic 215,360 logic elements provide capacity for large-scale digital logic implementation.
- Configurable Logic Blocks 16,825 CLBs to organize and map complex logic functions efficiently.
- Embedded Memory Approximately 13.46 Mbits of on-chip RAM for buffering, state machines, and data storage.
- I/O Density Up to 400 I/O pins to support a wide range of external interfaces and system integration.
- Package and Mounting 676-BBGA / 676-FCBGA (27×27) surface-mount package for high-density board designs.
- Power Core voltage supply specified from 0.950 V to 1.05 V to match system power rails.
- Temperature and Grade Industrial grade operation from −40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS compliant, supporting regulatory and manufacturing requirements.
Unique Advantages
- High Logic Capacity: 215,360 logic elements enable substantial on-chip logic integration, reducing the need for external ASICs or multiple FPGAs.
- Significant Embedded Memory: Approximately 13.46 Mbits of RAM supports larger buffers and more complex state retention without external memory.
- Flexible I/O Count: 400 available I/O pins allow direct interfacing to multiple peripherals and high-density connectors.
- Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in industrial and temperature-demanding applications.
- Compact, High-Density Package: 676-FCBGA (27×27) surface-mount package offers a compact footprint for space-constrained PCBs while maintaining high pin count.
- Standards-Friendly Compliance: RoHS compliance simplifies integration into modern manufacturing and regulatory workflows.
Why Choose XC7A200T-L1FBG676I?
The XC7A200T-L1FBG676I combines substantial logic and memory resources with a high pin count and an industrial temperature rating, making it well suited to designs that require integration, robustness, and on-chip capacity. Its 676-FCBGA package and defined supply voltage range support compact, power-aware system implementations.
This device is appropriate for engineers and purchasers seeking a programmable, high-capacity FPGA with on-chip memory and a broad I/O complement, backed by compliance for modern manufacturing processes.
Request a quote or submit a procurement inquiry to obtain pricing and availability for the XC7A200T-L1FBG676I and accelerate your design planning.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








