XC7A200T-L1FBG484I

The XC7A200T-L1FBG484I is an Artix-7 Field Programmable Gate Array (FPGA) IC in a 484‑BBGA FCBGA package. It provides 16,825 configurable logic blocks (CLBs), 215,360 logic elements, approximately 13.46 Mbits of embedded memory and 285 I/O connections, making it suitable for designs that require substantial on-chip logic, memory and I/O density. The device is industrial grade with a core voltage range of 950 mV to 1.05 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic 16,825 configurable logic blocks (CLBs) and 215,360 logic elements provide significant capacity for implementing complex digital functions and custom logic architectures.
• Embedded Memory Approximately 13.46 Mbits of on-chip RAM available for buffering, FIFOs, and implemented memory structures to reduce external memory requirements.
• I/O and Package 285 I/O pins in a 484‑BBGA FCBGA package (supplier package: 484‑FCBGA, 23×23) deliver high-density connectivity in a surface-mount form factor.
• Power Core supply voltage range of 950 mV to 1.05 V for the FPGA core power domain.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
• Mounting & Compliance Surface mount device; RoHS compliant.

Typical Applications

• Industrial Control Implement control logic, protocol handling and I/O aggregation in industrial systems that require an industrial temperature range and robust I/O capacity.
• Communications Equipment Use the device for interface bridging, packet processing or custom protocol logic where many I/O and sizable on-chip logic are beneficial.
• Embedded Prototyping and Development Leverage the device’s large logic and memory resources for system prototyping and development of complex embedded designs.
• Signal and Video Processing Deploy on-chip memory and logic capacity to implement processing pipelines, buffering and custom accelerators for digital signal tasks.

Unique Advantages

• High logic capacity: 215,360 logic elements and 16,825 CLBs enable implementation of large, complex designs on a single device.
• Substantial on-chip memory: Approximately 13.46 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level design.
• Ample connectivity in a compact package: 285 I/O in a 484‑BBGA FCBGA (23×23) package provides dense I/O while maintaining a surface-mount footprint.
• Industrial temperature range: Rated for −40 °C to 100 °C to support deployment in industrial environments.
• Low-voltage core operation: 0.95 V to 1.05 V core supply aligns with modern power domains for efficient integration.
• RoHS compliant: Meets environmental compliance requirements for lead-free manufacturing.

Why Choose XC7A200T-L1FBG484I?

The XC7A200T-L1FBG484I combines a large logic fabric, significant embedded memory and a high count of I/O in a compact 484‑BBGA FCBGA surface-mount package. Its industrial temperature rating and RoHS compliance make it appropriate for demanding embedded and industrial applications that require reliable, reconfigurable logic and substantial on-chip resources.

This device is well suited for engineers and system designers who need to implement complex custom logic, buffering and interfacing within a single FPGA device, reducing external components and enabling denser board-level integration.

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