XC7A200T-3SBG484E

IC FPGA 285 I/O 484FCBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 285 13455360 215360 484-FBGA, FCBGA

Quantity 1,707 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (19x19)GradeExtendedOperating Temperature0°C – 100°C
Package / Case484-FBGA, FCBGANumber of I/O285Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs16825Number of Logic Elements/Cells215360
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13455360

Overview of XC7A200T-3SBG484E – Artix-7 Field Programmable Gate Array (FPGA) IC 285 13455360 215360 484-FBGA, FCBGA

The XC7A200T-3SBG484E is an AMD Artix-7 Field Programmable Gate Array (FPGA) supplied in a 484-FBGA (19×19) surface-mount package. It provides a high on-chip resource count—215,360 logic elements and 13,455,360 total RAM bits—alongside a 285-pin I/O footprint for dense, I/O-rich designs.

Designed for extended-grade operation, this device runs from a core voltage range of 950 mV to 1.05 V and supports an operating temperature range of 0 °C to 100 °C. The part is RoHS compliant.

Key Features

  • Core Architecture Artix-7 FPGA from AMD providing programmable logic fabric in a high-capacity device.
  • Logic Capacity 215,360 logic elements for large-scale logic integration within a single FPGA.
  • Embedded Memory Total on-chip RAM of 13,455,360 bits—approximately 13.46 Mbits of embedded memory for buffering and state storage.
  • I/O Density 285 I/O pins to support multiple peripherals, interfaces, and high-pin-count designs.
  • Power Core voltage supply range from 950 mV to 1.05 V to match low-voltage power domains.
  • Package and Mounting 484-FBGA (484-FCBGA, 19×19) surface-mount package providing a compact, high-density footprint.
  • Grade and Temperature Extended grade device rated for 0 °C to 100 °C ambient operation.
  • Compliance RoHS compliant for conformity with common environmental requirements.

Unique Advantages

  • High programmable capacity: 215,360 logic elements enable consolidation of complex functions into a single FPGA, reducing external component count.
  • Substantial on-chip memory: Approximately 13.46 Mbits of embedded RAM supports large buffers, lookup tables, and state machines without relying on external memory.
  • Strong I/O capability: 285 I/O pins accommodate multiple interfaces and parallel data paths within a compact package.
  • Compact, high-density packaging: 484-FBGA (19×19) provides a small PCB footprint for applications where board space is limited.
  • Extended-grade operation: Specified for 0 °C to 100 °C, offering suitability for environments within that temperature range.
  • RoHS compliant: Meets common environmental and regulatory material requirements.

Why Choose XC7A200T-3SBG484E?

The XC7A200T-3SBG484E brings together a large logic element count, significant embedded memory, and a high I/O count in a compact 484-FBGA package, making it well suited for designs that require substantial programmable resources within a constrained board area. Its extended-grade temperature rating and RoHS compliance provide predictable operation and regulatory alignment for many commercial and industrial applications operating between 0 °C and 100 °C.

This AMD Artix-7 device is a fit for engineers and procurement teams seeking a single-FPGA solution that balances logic capacity, on-chip memory, and I/O density while maintaining low-voltage core compatibility and a compact surface-mount package.

Request a quote for the XC7A200T-3SBG484E to check availability and pricing, or submit a quote request to begin procurement for your project needs.

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