XC7A200T-3FBG484E

The XC7A200T-3FBG484E is an Artix-7 Field Programmable Gate Array (FPGA) in a 484-FCBGA (23×23) surface-mount package. It provides a large logic fabric alongside substantial on-chip RAM and a high user I/O count, targeting designs that require significant programmable logic capacity and embedded memory.

Key device parameters include approximately 215,360 logic elements, about 13.46 Mbits of total on-chip RAM, 285 user I/O pins, an extended grade operating range (0 °C to 100 °C), and a core supply voltage range of 950 mV to 1.05 V.

Key Features

• Core Logic Capacity  Approximately 215,360 logic elements providing large-scale programmable logic resources for complex designs.
• Configurable Logic Blocks (CLBs)  Contains 16,825 CLBs to structure and distribute logic across the device.
• Embedded Memory  Total on-chip RAM of 13,455,360 bits (approximately 13.46 Mbits) for data buffering, state storage, and local memory needs.
• I/O Count  285 user I/O pins to support multiple interfaces, parallel buses, and peripheral connections.
• Package & Mounting  484-FCBGA package (23×23) in a surface-mount form factor for compact board-level integration.
• Power  Core voltage supply range of 950 mV to 1.05 V to match system power domains and design requirements.
• Temperature & Grade  Extended-grade device specified for operation from 0 °C to 100 °C.
• Compliance  RoHS compliant for environmental regulation alignment in manufacturing and deployment.

Typical Applications

• High-density FPGA designs  Used where a large number of logic elements and CLBs are required to implement complex digital logic and custom accelerators.
• I/O-rich systems  Suitable for designs that need extensive peripheral interfacing or multiple parallel buses owing to its 285 user I/O pins.
• Embedded memory-dependent functions  On-chip RAM (approximately 13.46 Mbits) supports buffering, lookup tables, and stateful processing within the FPGA fabric.
• Compact board-level integration  The 484-FCBGA surface-mount package allows integration into dense PCB layouts where board area and form factor are constrained.

Unique Advantages

• Large logic capacity: 215,360 logic elements enable implementation of sizable logic designs without external programmable logic expansion.
• Substantial on-chip memory: Approximately 13.46 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-storage tasks.
• High pin count: 285 user I/O pins provide flexibility for connecting multiple peripherals, sensors, and high-speed interfaces.
• Compact FCBGA package: 484-FCBGA (23×23) surface-mount package supports high-density system integration while maintaining thermal and mechanical stability on the PCB.
• Controlled power domain: Core supply range of 950 mV to 1.05 V allows predictable power design and supply planning.
• Extended operating range: Specified for 0 °C to 100 °C operation for deployments that require broader ambient temperature tolerance.

Why Choose XC7A200T-3FBG484E?

The XC7A200T-3FBG484E combines a large logic fabric, substantial embedded memory, and a high I/O count in a compact 484-FCBGA surface-mount package. Its specification set is well suited to engineers and procurement teams seeking scalable programmable logic capacity with integrated RAM and versatile interfacing in a single device.

With an extended operating temperature range and RoHS compliance, this FPGA is appropriate for designs that require robust on-chip resources, predictable power domains, and compact board-level deployment. It is ideal for development teams implementing complex digital functions, memory-heavy logic, or I/O-dense systems that benefit from integrated programmable logic.

If you would like pricing, availability, or to request a formal quote for the XC7A200T-3FBG484E, submit an inquiry or request a quote and our team will respond with the next steps.