XC7A200T-2FFV1156I

The XC7A200T-2FFV1156I is an Artix‑7 Field Programmable Gate Array (FPGA) in a 1156‑ball BGA FCBGA package. It provides a high-density programmable fabric with a large logic element count, substantial embedded RAM, and a broad I/O complement targeted for industrial applications.

This device is suited for designs that require extensive reconfigurable logic, significant on‑chip memory, and high I/O integration while supporting industrial temperature ranges and surface‑mount board assembly.

Key Features

• Logic Capacity — 215,360 logic elements to implement complex digital functions and large-scale logic designs.
• Embedded Memory — approximately 12.8 Mbits of on‑chip RAM for buffering, local data storage, and state machines.
• I/O Density — 500 user I/O pins to support extensive peripheral interfacing and signal routing without excessive external components.
• Power — Core supply range of 0.95 V to 1.05 V to match system power rails and design constraints.
• Package and Mounting — 1156‑BBGA (1156‑FCBGA) surface‑mount package; supplier device package specified as 1156‑FCBGA (35×35) for compact, high‑density board layouts.
• Temperature and Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance — RoHS compliant to meet common environmental requirements.

Typical Applications

• Industrial Control — High logic capacity and 500 I/O support control, monitoring, and I/O consolidation tasks in industrial automation systems.
• Signal Processing — Substantial on‑chip RAM and large logic element count enable data buffering and implementation of complex processing pipelines.
• System Integration — Compact 1156‑FCBGA package and high I/O count allow integration of multiple functions into a single FPGA to reduce board complexity.

Unique Advantages

• High Logic Density: 215,360 logic elements provide headroom for complex algorithms and multi‑function designs.
• Significant On‑Chip Memory: Approximately 12.8 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Large I/O Complement: 500 I/O pins simplify connectivity to sensors, actuators, and external devices without large GPIO expanders.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in harsh or temperature‑variable environments.
• Compact FCBGA Package: 1156‑ball FCBGA (35×35) enables high‑density board designs where PCB space is constrained.
• RoHS Compliant: Conforms to common environmental requirements for professional and industrial products.

Why Choose XC7A200T-2FFV1156I?

The XC7A200T-2FFV1156I positions itself as a scalable, high‑density solution for industrial designs that demand extensive programmable logic, ample embedded memory, and a large number of I/O. Its industrial temperature rating and surface‑mount FCBGA packaging make it suitable for compact, rugged systems where integration and reliability are important.

Designers seeking to consolidate multiple functions into a single FPGA, implement sizable signal processing or control logic, and minimize external components will find the device’s combination of logic capacity, memory, and I/O advantageous.

Request a quote or submit a request for pricing and availability to get detailed procurement information for the XC7A200T-2FFV1156I.