XC7A200T-2FFG1156I

The XC7A200T-2FFG1156I is an AMD Artix-7 family Field Programmable Gate Array (FPGA) supplied in a 1156-FCBGA (35×35) surface-mount package. It provides a high logic element count and substantial on-chip memory for designs that require dense programmable logic and large I/O capacity.

With 215,360 logic elements, approximately 13.46 Mbits of embedded memory and 500 I/O pins, this industrial-grade FPGA is positioned for systems that need high integration, significant local RAM and broad external connectivity while operating across an industrial temperature range.

Key Features

• Logic Resources – 215,360 logic elements provide a high-capacity fabric for implementing complex digital functions and large-scale logic integration.
• Embedded Memory – Approximately 13.46 Mbits of on-chip RAM enable local storage for buffering, lookup tables and state machines without relying exclusively on external memory.
• I/O Capacity – 500 programmable I/O pins support extensive interfacing to sensors, peripherals and high-pin-count systems.
• Power Supply – Core voltage range from 0.95 V to 1.05 V supports defined power rails for the FPGA core.
• Thermal and Reliability – Industrial operating temperature range of –40 °C to 100 °C for deployment in temperature-sensitive environments.
• Package and Mounting – 1156-BBGA (1156-FCBGA, 35×35) surface-mount package suited for high-density PCB designs.
• Compliance – RoHS-compliant material status for environmental and regulatory considerations.

Typical Applications

• High-density digital processing – Use the large logic resource pool and embedded memory to implement complex signal processing pipelines and custom accelerators.
• Industrial control systems – Industrial-grade temperature range and broad I/O count make it suitable for automation controllers and factory-floor equipment.
• I/O-intensive interface bridging – 500 I/Os provide flexibility to aggregate and translate between multiple peripheral and bus standards on a single device.
• System consolidation and prototyping – Combine multiple discrete functions into a single FPGA platform to reduce BOM and enable rapid design iteration.

Unique Advantages

• High logic density: 215,360 logic elements enable large-scale integration of custom logic and state machines on one device.
• Substantial on-chip RAM: Approximately 13.46 Mbits of embedded memory reduces dependence on external memory for buffering and local data storage.
• Extensive I/O: 500 I/O pins provide flexible connectivity for complex, multi-interface designs.
• Industrial thermal range: Rated for –40 °C to 100 °C, supporting deployment in demanding ambient conditions.
• Space-efficient packaging: 1156-FCBGA (35×35) surface-mount package enables high-density PCB implementations while maintaining a large resource set.
• Regulatory readiness: RoHS-compliant construction for environmentally conscious designs.

Why Choose XC7A200T-2FFG1156I?

The XC7A200T-2FFG1156I provides a balanced combination of high logic capacity, significant embedded memory and large I/O resources in an industrial-grade, surface-mount FCBGA package. It is well suited for engineers targeting consolidation of complex digital functions, memory-heavy algorithms and I/O-rich interfaces within a single programmable device.

For development teams and procurement professionals seeking a scalable FPGA platform with clear electrical and thermal specifications, this Artix-7 device offers the integration and environmental robustness needed to support long-term deployments and iterative design cycles.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC7A200T-2FFG1156I.