XC7A200T-2FBG676C

The XC7A200T-2FBG676C is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides a high-density programmable fabric with 215,360 logic elements and approximately 13.46 Mbits of on-chip RAM in a 676-ball FCBGA package.

This device is supplied in a 676-FCBGA (27×27) surface-mount package, supports a core supply range of 0.95 V to 1.05 V, and operates across a commercial temperature range of 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Core Logic  215,360 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 13.46 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Resources  400 available I/O pins for broad external connectivity and high-pin-count interface support.
• Power  Core voltage supply range of 0.95 V to 1.05 V to match system power architectures and enable predictable core operation.
• Package & Mounting  676-FCBGA (27×27) supplier device package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.

Unique Advantages

• High logic density: 215,360 logic elements enable implementation of large, complex designs without discrete co-processors.
• Significant on-chip memory: Approximately 13.46 Mbits of embedded RAM reduces external memory dependency for latency-sensitive functions.
• Extensive I/O count: 400 I/Os allow flexible interfacing to multiple peripherals, sensors, and high-pin-count connectors.
• Compact FCBGA package: 676-ball FCBGA (27×27) supports dense PCB layouts while preserving signal density.
• Predictable power envelope: Core supply support from 0.95 V to 1.05 V aligns with common FPGA power rails for straightforward power-supply design.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation suitable for a wide range of general-purpose electronic applications.

Why Choose XC7A200T-2FBG676C?

The XC7A200T-2FBG676C delivers a combination of large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact 676-FCBGA surface-mount package. Its voltage and temperature specifications make it suitable for commercial designs that require deterministic on-chip resources and robust board-level integration.

This device is well suited to designers who need scalable, high-density FPGA capacity with extensive I/O and on-chip RAM, and who value RoHS-compliant components for streamlined manufacturing and compliance.

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