XC7A200T-2FBG484C

IC FPGA 285 I/O 484FCBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 285 13455360 215360 484-BBGA, FCBGA

Quantity 608 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGA, FCBGANumber of I/O285Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs16825Number of Logic Elements/Cells215360
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13455360

Overview of XC7A200T-2FBG484C – Artix-7 Field Programmable Gate Array (FPGA), 484-FCBGA

The XC7A200T-2FBG484C is an Artix-7 Field Programmable Gate Array (FPGA) IC presented in a 484-ball FCBGA package. It delivers a high logic density and on-chip memory footprint in a surface-mount 484-FCBGA (23×23) package suitable for commercial-grade designs.

With 16825 configurable logic blocks and 215,360 logic elements plus approximately 13.46 Mbits of embedded RAM, this device targets designs that require substantial programmable logic, embedded memory and a large I/O count within a commercial operating temperature range.

Key Features

  • Logic Capacity: 16825 CLBs and 215,360 logic elements provide high-density programmable logic for complex digital designs.
  • On-chip Memory: Approximately 13.46 Mbits of embedded RAM to support data buffering, state storage and memory-intensive logic functions.
  • I/O Resources: 285 user I/O pins to accommodate high-pin-count interfacing and multiple peripheral connections.
  • Power Supply: Core voltage range of 0.95 V to 1.05 V for the device core supply.
  • Package & Mounting: 484-BBGA / 484-FCBGA (23×23) package in a surface-mount form factor for compact board-level integration.
  • Operating Range & Grade: Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance: RoHS-compliant material status for regulatory alignment in commercial products.

Typical Applications

  • High-density digital systems: Use the device’s 215,360 logic elements to implement complex custom logic and state machines.
  • Memory-heavy processing: Leverage approximately 13.46 Mbits of embedded RAM for buffering, packet storage or local data processing.
  • Multi-interface designs: 285 I/Os enable integration with numerous external peripherals, sensors and interfaces on a single device.

Unique Advantages

  • Substantial logic resource: Large CLB and logic element counts reduce the need for multiple devices when implementing complex designs.
  • Significant embedded memory: Approximately 13.46 Mbits of on-chip RAM simplifies memory management and lowers external memory dependency.
  • High I/O count: 285 I/Os support dense interfacing requirements and flexible board-level connectivity.
  • Compact package: 484-FCBGA (23×23) provides a high-pin-count footprint in a surface-mount form factor for space-constrained layouts.
  • Commercial readiness: Commercial grade and RoHS compliance streamline integration into commercial product lines.

Why Choose XC7A200T-2FBG484C?

The XC7A200T-2FBG484C positions itself as a high-density, memory-capable Artix-7 FPGA in a compact 484-FCBGA package for commercial applications. Its combination of 16825 CLBs, 215,360 logic elements, approximately 13.46 Mbits of embedded RAM and 285 I/Os makes it a strong candidate for designs requiring extensive programmable logic, on-chip storage and broad interfacing within the 0 °C to 85 °C operating window.

Choosing this part offers scalability for complex digital designs while maintaining a compact board footprint and RoHS compliance for commercial deployments.

Request a quote or submit a procurement inquiry for the XC7A200T-2FBG484C to receive pricing and availability information tailored to your project needs.

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