XC7A200T-1SBG484I
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 285 13455360 215360 484-FBGA, FCBGA |
|---|---|
| Quantity | 1,884 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA, FCBGA | Number of I/O | 285 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 16825 | Number of Logic Elements/Cells | 215360 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13455360 |
Overview of XC7A200T-1SBG484I – Artix-7 Field Programmable Gate Array (FPGA) IC 285 13455360 215360 484-FBGA, FCBGA
The XC7A200T-1SBG484I is an Artix‑7 field programmable gate array supplied in a 484‑FBGA surface‑mount package. It provides a high logic capacity FPGA fabric with significant on‑chip memory and a large number of I/O for demanding embedded designs.
Key device characteristics include 215,360 logic elements, approximately 13.46 Mbits of total RAM bits, 285 user I/O pins, an industrial operating temperature range of -40°C to 100°C, and a core supply range of 950 mV to 1.05 V.
Key Features
- Logic Capacity 215,360 logic elements to implement large, complex digital designs and custom hardware accelerators.
- Embedded Memory Approximately 13.46 Mbits of total on‑chip RAM to support buffering, frame storage, and state machines without external memory.
- High I/O Count 285 user I/O pins suitable for multi‑channel interfaces, sensor arrays, and broad peripheral connectivity.
- Power Supply Range Core voltage specified from 950 mV to 1.05 V to match system power rails and regulator designs.
- Package & Mounting 484‑FBGA (supplier package: 484‑FCBGA 19×19) in a surface mount form factor for compact board layouts.
- Industrial Temperature Grade Rated for operation from -40°C to 100°C to meet industrial environmental requirements.
- Environmental Compliance RoHS compliant for reduced hazardous substance content.
Unique Advantages
- High integration density: 215,360 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
- Substantial on‑chip memory: Approximately 13.46 Mbits of embedded RAM lowers dependence on external memory and helps minimize system latency.
- Generous I/O resources: 285 I/O pins provide flexibility for parallel interfaces, multiple peripherals, and mixed-signal front ends.
- Industrial operating range: -40°C to 100°C supports deployment in temperature-variable environments common in industrial systems.
- Compact surface-mount package: 484‑FBGA / 484‑FCBGA (19×19) enables high-density PCB designs while keeping thermal and mechanical form factors consistent.
- RoHS compliance: Supports environmental and regulatory requirements for lead‑free manufacturing processes.
Why Choose XC7A200T-1SBG484I?
The XC7A200T-1SBG484I offers a balance of large logic capacity, significant embedded RAM, and extensive I/O in a compact 484‑FBGA package, making it suitable for complex FPGA-based systems that need dense integration and industrial temperature operation. Its specified supply and thermal ranges allow designers to align power and thermal management to device requirements.
This device is appropriate for engineering teams building robust, scalable digital designs that require substantial programmable logic and memory on a surface-mount FPGA platform, with the added benefit of RoHS compliance for modern manufacturing practices.
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








