XC7A200T-1FFG1156I

The XC7A200T-1FFG1156I is an Artix-7 Field Programmable Gate Array (FPGA) from AMD, offering a high-density programmable-logic fabric for demanding digital designs. It combines a large logic capacity with substantial embedded memory and a high I/O count to address applications that require significant on-chip resources and flexible I/O connectivity.

Packaged in a 1156-FCBGA (35×35 mm) surface-mount package and rated to industrial temperature limits, this device targets designs that need a balance of integration, configurable logic, and robust operating range.

Key Features

• Core Logic 215,360 logic elements provide extensive programmable logic capacity for complex state machines, custom accelerators, and system-on-chip implementations.
• Embedded Memory Approximately 13.45 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• I/O Density Up to 500 I/Os enable connectivity to a wide range of peripherals, buses, and high-pin-count interfaces.
• Power Supply Core voltage range of 0.95 V to 1.05 V for the programmable fabric.
• Package & Mounting 1156-FCBGA (35×35 mm) package in a surface-mount format for compact board-level integration.
• Industrial Temperature Range Rated for operation from -40°C to 100°C, suitable for thermally demanding environments.
• Compliance RoHS compliant, meeting common environmental material requirements.

Typical Applications

• High-density digital processing — Implement custom datapaths, protocol engines, and parallel processing functions using the device’s 215,360 logic elements and embedded RAM.
• I/O-intensive interface bridging — Use the 500 I/Os to connect multiple peripherals, translate between buses, or aggregate data from many sources.
• Industrial control and automation — Industrial temperature rating and robust packaging make the device suitable for control systems, motor drives, and factory automation logic.
• Memory-heavy embedded logic — Approximately 13.45 Mbits of on-chip memory supports local buffering, FIFOs, and lookup tables for low-latency data handling.

Unique Advantages

• High logic capacity: 215,360 logic elements enable large, integrated designs that reduce the need for multiple devices.
• Significant on-chip memory: Approximately 13.45 Mbits of embedded RAM reduces dependency on external memory and improves data locality.
• Extensive I/O count: Up to 500 I/Os provide flexibility to interface with numerous peripherals and external components on a single package.
• Industrial operating range: Rated from -40°C to 100°C to support deployment in rugged or temperature-variable environments.
• Compact FCBGA package: 1156-FCBGA (35×35 mm) surface-mount form factor balances board space and high pin count for dense system designs.
• RoHS compliant: Meets environmental material standards commonly required in modern electronic designs.

Why Choose XC7A200T-1FFG1156I?

The XC7A200T-1FFG1156I positions itself as a high-capacity, industrial-grade Artix-7 FPGA suited for designs that demand substantial programmable logic, embedded memory, and broad I/O connectivity. Its combination of 215,360 logic elements, approximately 13.45 Mbits of on-chip RAM, and up to 500 I/Os makes it a practical choice for integrated digital systems, interface consolidation, and memory-rich applications.

Backed by AMD manufacturing and delivered in a compact 1156-FCBGA package with a wide operating temperature range, this device supports designs that require robust operation and high integration density while meeting RoHS material requirements.

Request a quote or submit an inquiry to get pricing and availability for the XC7A200T-1FFG1156I. Technical and procurement teams can request further information or a formal quotation to evaluate the device for your next design.