XC7A200T-1FF1156I

The XC7A200T-1FF1156I is an Artix‑7 field programmable gate array (FPGA) IC supplied in a 1156‑FBGA (FCBGA) package. It provides a high logic capacity and on‑chip memory combined with a large I/O count for demanding programmable logic designs.

With 215,360 logic elements, approximately 13.46 Mbits of embedded memory, and up to 500 I/O, this device is targeted at designs that require dense programmable logic, substantial on‑chip RAM, and broad I/O connectivity within an industrial temperature range.

Key Features

• Core Logic  215,360 logic elements provide a large resource pool for implementing complex digital logic and custom hardware functions.
• On‑Chip Memory  Approximately 13.46 Mbits of embedded RAM to support buffering, state storage, and intermediate data processing within the FPGA fabric.
• I/O Capacity  Up to 500 I/O pins enable extensive external interfacing, peripheral connectivity, and parallel data paths.
• Package  1156‑FBGA (1156‑FCBGA, 35×35) package for high‑density routing and compact board integration.
• Power  Core supply range of 950 mV to 1.05 V to match system power rails and enable predictable power budgeting.
• Thermal and Mounting  Surface mount device rated for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
• Compliance  RoHS compliant, supporting regulatory requirements for material content.

Typical Applications

• Industrial Control  Implement custom control logic, sensor interfacing, and machine I/O using the device's extensive logic and I/O resources within an industrial temperature range.
• High‑I/O Protocol Bridging  Use the 500 available I/Os to bridge multiple interfaces and manage parallel data streams between subsystems.
• Embedded System Acceleration  Leverage large logic and on‑chip RAM for hardware offload of compute‑intensive or deterministic tasks in embedded designs.
• Prototyping and System Integration  Dense logic and memory resources in a compact FCBGA package enable board‑level integration and iterative design development.

Unique Advantages

• High Logic Density: 215,360 logic elements allow implementation of complex finite state machines, control logic, and custom datapaths without external ASICs.
• Substantial On‑Chip Memory: Approximately 13.46 Mbits of RAM reduce dependence on external memory for buffering and temporary storage.
• Large I/O Count: 500 I/O pins provide flexibility for wide peripheral support and parallel interface requirements.
• Industrial Temperature Range: Rated for −40 °C to 100 °C, supporting deployments in temperature‑variable industrial environments.
• Compact FCBGA Package: The 1156‑FCBGA (35×35) package offers a compact footprint for high‑density PCB designs.
• RoHS Compliant: Meets material regulations to support environmentally conscious product builds.

Why Choose XC7A200T-1FF1156I?

The XC7A200T-1FF1156I combines a large logic fabric, significant embedded RAM, and an extensive I/O budget in a compact 1156‑FCBGA package with industrial temperature capability. It is suited for engineers and system designers who need programmable logic resources, on‑chip memory, and broad connectivity in industrial applications.

Choosing this Artix‑7 FPGA supports scalable design development by providing a balance of integration and robustness, enabling reduced external component count and consistent operation across a wide temperature range.

Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for the XC7A200T-1FF1156I.