XC7A200T-1FFG1156C

The XC7A200T-1FFG1156C is an Artix-7 field programmable gate array (FPGA) IC from AMD, delivering high logic density and on-chip memory in a compact FCBGA package. It combines 215,360 logic elements with approximately 13.46 Mbits of embedded RAM and up to 500 user I/O to address complex programmable-logic requirements.

Designed for surface-mount board integration, this commercially graded device operates from a core supply of 0.95 V to 1.05 V and across a 0 °C to 85 °C ambient range, providing a balance of density, memory, and I/O connectivity for a range of embedded applications.

Key Features

• Core Logic — 215,360 logic elements provide substantial capacity for large custom logic implementations and complex datapaths.
• Embedded Memory — Approximately 13.46 Mbits of on-chip RAM for buffering, frame storage, and state retention within the FPGA fabric.
• I/O Capacity — Up to 500 user I/O pins to support wide external interfacing and multi-channel connectivity.
• Power — Core voltage supply range of 0.95 V to 1.05 V for operation at specified core levels.
• Package & Mounting — 1156-BBGA (1156-FCBGA, 35×35) surface-mount package optimized for dense board layouts and module integration.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Complex digital systems — Use the large logic element count and embedded RAM for sizable custom logic and datapath implementations.
• High-pin-count interface designs — Leverage up to 500 I/O for multi-channel interfaces, parallel buses, and dense external connectivity.
• Compact module integration — The 1156-FCBGA (35×35) surface-mount package supports compact board and module layouts where board space and mounting density matter.

Unique Advantages

• High logic density: 215,360 logic elements enable integration of large, consolidated logic functions that reduce external components.
• Substantial on-chip memory: Approximately 13.46 Mbits of embedded RAM supports local buffering and state storage without immediate external memory.
• Extensive I/O capability: 500 user I/O pins provide flexibility for connecting multiple peripherals, sensors, or parallel interfaces.
• Compact, surface-mount packaging: 1156-FCBGA (35×35) package supports high-density PCB designs and module-level assembly.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match general-purpose embedded applications.
• RoHS compliant: Meets environmental compliance expectations for lead-free assembly.

Why Choose XC7A200T-1FFG1156C?

The XC7A200T-1FFG1156C positions itself as a high-density, memory-rich Artix-7 FPGA option from AMD, offering a combination of extensive logic resources, significant on-chip RAM, and broad I/O capability in a compact FCBGA surface-mount package. Its commercial temperature grade and RoHS compliance make it suitable for many embedded designs that require consolidated programmable logic and local memory.

This device is well suited to engineering teams designing advanced digital systems and modules that need substantial programmable resources while maintaining a compact board footprint. Choosing this FPGA provides a scalable platform within the Artix-7 family backed by an established manufacturer.

Request a quote or submit an inquiry for XC7A200T-1FFG1156C today to check availability and pricing for your next design.