XC7A200T-1FFV676C4373

The XC7A200T-1FFV676C4373 is an Artix-7 field programmable gate array (FPGA) device from AMD. It provides a high density of programmable logic paired with on-chip memory and a large I/O count in a compact 676‑FCBGA surface-mount package.

Designed for commercial-grade embedded designs that require significant logic capacity, on-chip RAM and extensive I/O in a single-package FPGA, the device supports implementations where board space and component integration are important design considerations.

Key Features

• Logic Capacity  Provides 215,360 logic elements for implementing complex digital designs and custom logic functions.
• Embedded Memory  Contains approximately 13.46 Mbits of on-chip RAM to support data buffering, state storage, and algorithmic implementations.
• I/O Count  Offers 400 general-purpose I/O pins to interface with external peripherals and system components.
• Package & Mounting  Available in a 676‑BBGA / 676‑FCBGA package; supplier device package specified as 676‑FCBGA (27×27). Surface-mount mounting type.
• Power Supply  Operates with a core voltage supply range of 950 mV to 1.05 V.
• Operating Conditions & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Implement complex logic and parallel processing functions using the device's 215,360 logic elements and substantial on-chip RAM.
• Embedded system integration  Consolidate discrete functions and interface logic in commercial embedded products where board area and part count are constrained.
• Prototyping and development  Use the programmable fabric and abundant I/O for development and validation of custom digital IP in a compact FCBGA form factor.

Unique Advantages

• High logic density: 215,360 logic elements enable large-scale logic implementations without external gate arrays.
• Significant on-chip RAM: Approximately 13.46 Mbits of embedded memory reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O capability: 400 I/Os provide flexible connectivity options for peripherals, sensors, and board-level interfaces.
• Compact, surface-mount package: The 676‑FCBGA (27×27) package supports compact designs and high pin density in surface-mount assemblies.
• Low-voltage core operation: Core supply range of 950 mV to 1.05 V supports modern low-voltage FPGA power architectures.
• RoHS compliant: Meets environmental compliance requirements for commercial electronic products.

Why Choose XC7A200T-1FFV676C4373?

The XC7A200T-1FFV676C4373 positions itself as a high-density, commercial-grade FPGA option for designers who need substantial logic capacity, on-chip memory and a large number of I/Os in a compact surface-mount package. Its combination of 215,360 logic elements, approximately 13.46 Mbits of embedded RAM and 400 I/O pins makes it suitable for complex programmable functions within constrained board footprints.

For teams developing commercial embedded systems, prototyping advanced digital logic, or consolidating multiple functions onto a single programmable device, this Artix-7 FPGA delivers a balance of integration and configuration flexibility backed by AMD manufacturing.

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