XC7A200T-1SBG484C

IC FPGA 285 I/O 484FCBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 285 13455360 215360 484-FBGA, FCBGA

Quantity 947 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGA, FCBGANumber of I/O285Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs16825Number of Logic Elements/Cells215360
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13455360

Overview of XC7A200T-1SBG484C – Artix‑7 FPGA, 215,360 logic elements (484‑FBGA)

The XC7A200T-1SBG484C is an Artix‑7 Field Programmable Gate Array (FPGA) IC offering a high logic density and substantial on‑chip memory in a compact 484‑FBGA package. It is intended for commercial applications that require a combination of large programmable logic capacity, significant embedded RAM, and a broad I/O count.

With a wide supply voltage window and surface‑mount package options, this device is suitable for designs that prioritize integration of logic, memory and I/O while conforming to commercial temperature and environmental requirements.

Key Features

  • Logic Density  Provides 215,360 logic elements to implement complex digital designs and high‑capacity logic partitions.
  • Embedded Memory  Includes approximately 13.5 Mbits of on‑chip RAM (13,455,360 bits) for data buffering, state storage and intermediate processing.
  • I/O Capacity  285 user I/O pins to connect to peripherals, sensors and external interfaces without external multiplexing.
  • Power Supply  Core supply range of 0.95 V to 1.05 V to match system power architectures that support Artix‑7 device families.
  • Package & Mounting  484‑FBGA (484‑FCBGA, supplier package 19×19) in a surface‑mount form factor for compact PCB integration.
  • Operating Range & Grade  Commercial grade operation from 0 °C to 85 °C suitable for consumer and commercial products.
  • Environmental Compliance  RoHS compliant for adherence to common environmental and manufacturing requirements.

Unique Advantages

  • High integration density: 215,360 logic elements combined with ~13.5 Mbits of embedded RAM reduce the need for external logic and memory components.
  • Broad I/O support: 285 I/O pins enable direct interfacing to a wide range of peripherals and subsystems, simplifying board design.
  • Compact system footprint: 484‑FBGA surface‑mount package (19×19) supports space‑constrained PCBs while maintaining signal routing density.
  • Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial product requirements.
  • Predictable power envelope: Core supply range of 0.95 V–1.05 V allows integration into regulated power systems with defined voltage rails.

Why Choose XC7A200T-1SBG484C?

The XC7A200T-1SBG484C positions itself as a high‑capacity, commercially graded FPGA solution that brings together substantial programmable logic, embedded memory and extensive I/O in a compact surface‑mount 484‑FBGA package. Its specification set supports designs that require on‑chip resources to minimize external components while operating within standard commercial temperature and environmental constraints.

This device is well suited for engineers and procurement teams building commercial electronic systems that need scalable logic capacity, meaningful on‑chip RAM, and ample I/O — offering a balance of integration and predictable operating parameters for production designs.

Request a quote or contact sales to get pricing, availability and ordering information for the XC7A200T-1SBG484C.

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